M393B2K70CM0-CF8 datasheet, PDF

M393B2K70CM0-CF8: DescriptionDRAM Module, 2GX72, 0.3ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240; Categorystorage storage; File Size2MB，58 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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M393B2K70CM0-CF8 Overview

DRAM Module, 2GX72, 0.3ns, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	DIMM
package instruction	DIMM, DIMM240,40
Contacts	240
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.3 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	533 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N240
length	133.35 mm
memory density	154618822656 bit
Memory IC Type	DRAM MODULE
memory width	72
Humidity sensitivity level	2
Number of functions	1
Number of ports	1
Number of terminals	240
word count	2147483648 words
character code	2000000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	2GX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM240,40
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260
power supply	1.5 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	4 mm
self refresh	YES
Maximum standby current	1.89 A
Maximum slew rate	5.814 mA
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal form	NO LEAD
Terminal pitch	1 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	30 mm

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