IMS1400N-70M datasheet, PDF - EEWORLD Datasheet

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IMS1400N-70M: Description16KX1 STANDARD SRAM, 65ns, CQCC20, CERAMIC, LCC-20; Categorystorage storage; File Size224KB，9 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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IMS1400N-70M Overview

16KX1 STANDARD SRAM, 65ns, CQCC20, CERAMIC, LCC-20

IMS1400N-70M Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	QLCC
package instruction	CERAMIC, LCC-20
Contacts	20
Reach Compliance Code	not_compliant
ECCN code	3A001.A.2.C
Maximum access time	65 ns
I/O type	SEPARATE
JESD-30 code	R-CQCC-N20
JESD-609 code	e0
length	10.795 mm
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	1
Number of functions	1
Number of ports	1
Number of terminals	20
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16KX1
Output characteristics	3-STATE
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC20,.3X.43
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	1.981 mm
Maximum slew rate	0.12 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	NMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.36 mm

IMS1400N-70M Related Products

	IMS1400N-70M	IMS1400S-55M	IMS1400N-55M	IMS1400N-45M	IMS1400S-70M
Description	16KX1 STANDARD SRAM, 65ns, CQCC20, CERAMIC, LCC-20	16KX1 STANDARD SRAM, 50ns, CDIP20, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20	16KX1 STANDARD SRAM, 50ns, CQCC20, CERAMIC, LCC-20	16KX1 STANDARD SRAM, 40ns, CQCC20, CERAMIC, LCC-20	16KX1 STANDARD SRAM, 65ns, CDIP20, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	QLCC	DIP	QLCC	QLCC	DIP
package instruction	CERAMIC, LCC-20	0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20	CERAMIC, LCC-20	CERAMIC, LCC-20	0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20
Contacts	20	20	20	20	20
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	65 ns	50 ns	50 ns	40 ns	65 ns
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-CQCC-N20	R-CDIP-T20	R-CQCC-N20	R-CQCC-N20	R-CDIP-T20
JESD-609 code	e0	e0	e0	e0	e0
length	10.795 mm	25.4 mm	10.795 mm	10.795 mm	25.4 mm
memory density	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	1	1	1	1	1
Number of functions	1	1	1	1	1
Number of ports	1	1	1	1	1
Number of terminals	20	20	20	20	20
word count	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	16KX1	16KX1	16KX1	16KX1	16KX1
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO	NO
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN	DIP	QCCN	QCCN	DIP
Encapsulate equivalent code	LCC20,.3X.43	DIP20,.3	LCC20,.3X.43	LCC20,.3X.43	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum seat height	1.981 mm	3.124 mm	1.981 mm	1.981 mm	3.124 mm
Maximum slew rate	0.12 mA	0.12 mA	0.12 mA	0.12 mA	0.12 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES	NO
technology	NMOS	NMOS	NMOS	NMOS	NMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	QUAD	DUAL	QUAD	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.36 mm	7.62 mm	7.36 mm	7.36 mm	7.62 mm

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