DDR DRAM Module, 512MX64, CMOS, LEAD FREE, MO-269R/CB, UDIMM-240
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Micron Technology |
Parts packaging code | DIMM |
package instruction | DIMM, |
Contacts | 240 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
access mode | DUAL BANK PAGE BURST |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-XDMA-N240 |
JESD-609 code | e4 |
length | 133.35 mm |
memory density | 34359738368 bit |
Memory IC Type | DDR DRAM MODULE |
memory width | 64 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 240 |
word count | 536870912 words |
character code | 512000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512MX64 |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 30.5 mm |
self refresh | YES |
Maximum supply voltage (Vsup) | 1.575 V |
Minimum supply voltage (Vsup) | 1.425 V |
Nominal supply voltage (Vsup) | 1.5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Gold (Au) |
Terminal form | NO LEAD |
Terminal pitch | 1 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |