AM29BL802CB-80RDGK1 datasheet, PDF

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AM29BL802CB-80RDGK1: DescriptionFlash, 512KX16, 80ns, DIE-51; Categorystorage storage; File Size433KB，18 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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AM29BL802CB-80RDGK1 Overview

Flash, 512KX16, 80ns, DIE-51

AM29BL802CB-80RDGK1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	DIE
package instruction	DIE-51
Contacts	51
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	80 ns
Other features	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK
startup block	BOTTOM
JESD-30 code	R-XUUC-N51
JESD-609 code	e3
memory density	8388608 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	51
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX16
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	3 V
Certification status	Not Qualified
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	40
type	NOR TYPE

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Am29BL802C Known Good Die

Data Sheet

(Retired Product)

Am29BL802C Known Good Die Cover Sheet

This product has been retired and is not recommended for designs. Please contact your Spansion representative for

alternates. Availability of this document is retained for reference and historical purposes only.

The following document contains information on Spansion memory products.

Continuity of Specifications

There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been

made are the result of normal data sheet improvement and are noted in the document revision summary.

For More Information

Please contact your local sales office for additional information about Spansion memory solutions.

Publication Number

23694

Revision

Amendment

Issue Date

February 26, 2009

AM29BL802CB-80RDGK1 Related Products

	AM29BL802CB-80RDGK1	AM29BL802CB-80RDWK1	AM29BL802CB-80RDTF1	AM29BL802CB-80RDWF1	AM29BL802CB-80RDPF1	AM29BL802CB-80RDGF1	AM29BL802CB-80RDTK1	AM29BL802CB-80RDPK1
Description	Flash, 512KX16, 80ns, DIE-51	Flash, 512KX16, 80ns, WAFER-51	Flash, 512KX16, 80ns, DIE-51	Flash, 512KX16, 80ns, WAFER-51	Flash, 512KX16, 80ns, DIE-51	Flash, 512KX16, 80ns, DIE-51	Flash, 512KX16, 80ns, DIE-51	Flash, 512KX16, 80ns, DIE-51
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	DIE	WAFER	DIE	WAFER	DIE	DIE	DIE	DIE
package instruction	DIE-51	WAFER-51	DIE-51	WAFER-51	DIE-51	DIE-51	DIE-51	DIE-51
Contacts	51	51	51	51	51	51	51	51
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A001.A.2.C	3A001.A.2.C	EAR99	EAR99	EAR99	EAR99	3A001.A.2.C	3A001.A.2.C
Maximum access time	80 ns	80 ns	80 ns	80 ns	80 ns	80 ns	80 ns	80 ns
Other features	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK
startup block	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
JESD-30 code	R-XUUC-N51	R-XUUC-N51	R-XUUC-N51	R-XUUC-N51	R-XUUC-N51	R-XUUC-N51	R-XUUC-N51	R-XUUC-N51
JESD-609 code	e3	e3	e3	e3	e3	e3	e3	e3
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	51	51	51	51	51	51	51	51
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C	-55 °C
organize	512KX16	512KX16	512KX16	512KX16	512KX16	512KX16	512KX16	512KX16
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIE	DIE	DIE	DIE	DIE	DIE	DIE	DIE
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260
Programming voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	MILITARY
Terminal surface	TIN	TIN	TIN	TIN	TIN	TIN	TIN	TIN
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER	UPPER	UPPER	UPPER	UPPER	UPPER	UPPER
Maximum time at peak reflow temperature	40	40	40	40	40	40	40	40
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
Maker	SPANSION	-	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION

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