Standard SRAM, 8KX8, 20ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, MO-077AB, SOJ-28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | SONY |
Parts packaging code | SOJ |
package instruction | SOJ, SOJ28,.34 |
Contacts | 28 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 20 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-J28 |
JESD-609 code | e0 |
length | 18.42 mm |
memory density | 65536 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX8 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOJ |
Encapsulate equivalent code | SOJ28,.34 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.75 mm |
Maximum standby current | 0.001 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 0.1 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
CXK5866J-20 | CXK5866P-20 | CXK5866P-15 | CXK5866J-15 | |
---|---|---|---|---|
Description | Standard SRAM, 8KX8, 20ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, MO-077AB, SOJ-28 | Standard SRAM, 8KX8, 20ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, MO-058AB, DIP-28 | Standard SRAM, 8KX8, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, MO-058AB, DIP-28 | Standard SRAM, 8KX8, 15ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, MO-077AB, SOJ-28 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | SONY | SONY | SONY | SONY |
Parts packaging code | SOJ | DIP | DIP | SOJ |
package instruction | SOJ, SOJ28,.34 | DIP, DIP28,.3 | DIP, DIP28,.3 | SOJ, SOJ28,.34 |
Contacts | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 20 ns | 20 ns | 15 ns | 15 ns |
I/O type | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDSO-J28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-J28 |
JESD-609 code | e0 | e0 | e0 | e0 |
length | 18.42 mm | 35.1 mm | 35.1 mm | 18.42 mm |
memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 28 | 28 | 28 |
word count | 8192 words | 8192 words | 8192 words | 8192 words |
character code | 8000 | 8000 | 8000 | 8000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Exportable | YES | YES | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOJ | DIP | DIP | SOJ |
Encapsulate equivalent code | SOJ28,.34 | DIP28,.3 | DIP28,.3 | SOJ28,.34 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.75 mm | 4.4 mm | 4.4 mm | 3.75 mm |
Maximum standby current | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Maximum slew rate | 0.1 mA | 0.1 mA | 0.12 mA | 0.12 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |