M5M44170ATP-10 datasheet, PDF - EEWORLD Datasheet

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M5M44170ATP-10: DescriptionFast Page DRAM, 256KX16, 100ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP2-44/40; Categorystorage storage; File Size2MB，31 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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M5M44170ATP-10 Overview

Fast Page DRAM, 256KX16, 100ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP2-44/40

M5M44170ATP-10 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Mitsubishi
Parts packaging code	TSOP2
package instruction	TSOP2, TSOP40/44,.46,32
Contacts	44
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	100 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON
JESD-30 code	R-PDSO-G40
JESD-609 code	e0
length	18.41 mm
memory density	4194304 bit
Memory IC Type	FAST PAGE DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	40
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP40/44,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	1.2 mm
self refresh	NO
Maximum standby current	0.001 A
Maximum slew rate	0.09 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm

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Description	Fast Page DRAM, 256KX16, 100ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP2-44/40	Fast Page DRAM, 256KX16, 60ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, TSOP2-44/40	Fast Page DRAM, 256KX16, 80ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40	Fast Page DRAM, 256KX16, 80ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40	Fast Page DRAM, 256KX16, 60ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40	Fast Page DRAM, 256KX16, 70ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40	Fast Page DRAM, 256KX16, 100ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40	Fast Page DRAM, 256KX16, 70ns, CMOS, PDSO40, 0.400 INCH, PLASTIC, SOJ-40
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi	Mitsubishi
Parts packaging code	TSOP2	TSOP2	SOJ	SOJ	SOJ	SOJ	SOJ	SOJ
package instruction	TSOP2, TSOP40/44,.46,32	TSOP2, TSOP40/44,.46,32	SOJ, SOJ40,.44	SOJ, SOJ40,.44	SOJ, SOJ40,.44	SOJ, SOJ40,.44	SOJ, SOJ40,.44	SOJ, SOJ40,.44
Contacts	44	44	40	40	40	40	40	40
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE
Maximum access time	100 ns	60 ns	80 ns	80 ns	60 ns	70 ns	100 ns	70 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G40	R-PDSO-G40	R-PDSO-J40	R-PDSO-J40	R-PDSO-J40	R-PDSO-J40	R-PDSO-J40	R-PDSO-J40
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	18.41 mm	18.41 mm	26.04 mm	26.04 mm	26.04 mm	26.04 mm	26.04 mm	26.04 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	40	40	40	40	40	40	40	40
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16	256KX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2	SOJ	SOJ	SOJ	SOJ	SOJ	SOJ
Encapsulate equivalent code	TSOP40/44,.46,32	TSOP40/44,.46,32	SOJ40,.44	SOJ40,.44	SOJ40,.44	SOJ40,.44	SOJ40,.44	SOJ40,.44
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	1024	1024	1024	1024	1024	1024	1024	1024
Maximum seat height	1.2 mm	1.2 mm	3.55 mm	3.55 mm	3.55 mm	3.55 mm	3.55 mm	3.55 mm
self refresh	NO	YES	NO	YES	YES	NO	NO	YES
Maximum standby current	0.001 A	0.0001 A	0.001 A	0.0001 A	0.0001 A	0.001 A	0.001 A	0.0001 A
Maximum slew rate	0.09 mA	0.14 mA	0.105 mA	0.105 mA	0.14 mA	0.12 mA	0.09 mA	0.12 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	J BEND	J BEND	J BEND	J BEND	J BEND	J BEND
Terminal pitch	0.8 mm	0.8 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm

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