16KX16 DUAL-PORT SRAM, 25ns, PQCC84
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Rochester Electronics |
Reach Compliance Code | unknown |
Maximum access time | 25 ns |
Other features | SEMAPHORE |
JESD-30 code | S-PQCC-J84 |
JESD-609 code | e0 |
memory density | 262144 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 16 |
Humidity sensitivity level | NOT SPECIFIED |
Number of functions | 1 |
Number of terminals | 84 |
word count | 16384 words |
character code | 16000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 16KX16 |
Package body material | PLASTIC/EPOXY |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | COMMERCIAL |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | J BEND |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
QS7026A-25J | QS70261A-17TF | QS7026A-20J | QS70261A-35TF | QS70261A-25TF | QS70261A-20TF | QS7026A-55J | |
---|---|---|---|---|---|---|---|
Description | 16KX16 DUAL-PORT SRAM, 25ns, PQCC84 | 16KX16 MULTI-PORT SRAM, 17ns, PQFP100 | 16KX16 DUAL-PORT SRAM, 20ns, PQCC84 | 16KX16 MULTI-PORT SRAM, 35ns, PQFP100 | 16KX16 MULTI-PORT SRAM, 25ns, PQFP100 | 16KX16 MULTI-PORT SRAM, 20ns, PQFP100 | 16KX16 DUAL-PORT SRAM, 55ns, PQCC84 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 25 ns | 17 ns | 20 ns | 35 ns | 25 ns | 20 ns | 55 ns |
Other features | SEMAPHORE | INTERRUPT FLAG; SEMAPHORE | SEMAPHORE | INTERRUPT FLAG; SEMAPHORE | INTERRUPT FLAG; SEMAPHORE | INTERRUPT FLAG; SEMAPHORE | SEMAPHORE |
JESD-30 code | S-PQCC-J84 | S-PQFP-G100 | S-PQCC-J84 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQCC-J84 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
Memory IC Type | DUAL-PORT SRAM | MULTI-PORT SRAM | DUAL-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | DUAL-PORT SRAM |
memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Humidity sensitivity level | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 84 | 100 | 84 | 100 | 100 | 100 | 84 |
word count | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
character code | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 16KX16 | 16KX16 | 16KX16 | 16KX16 | 16KX16 | 16KX16 | 16KX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK | FLATPACK | FLATPACK | CHIP CARRIER |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | J BEND | GULL WING | J BEND | GULL WING | GULL WING | GULL WING | J BEND |
Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |