MK45H03K65TR datasheet, PDF - EEWORLD Datasheet

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MK45H03K65TR: Description2KX9 OTHER FIFO, 65ns, PQCC32, PLASTIC, LCC-32; Categorystorage storage; File Size447KB，16 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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MK45H03K65TR Overview

2KX9 OTHER FIFO, 65ns, PQCC32, PLASTIC, LCC-32

MK45H03K65TR Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	QFJ
package instruction	PLASTIC, LCC-32
Contacts	32
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	65 ns
Other features	RETRANSMIT
Maximum clock frequency (fCLK)	12.5 MHz
period time	80 ns
JESD-30 code	R-PQCC-J32
JESD-609 code	e0
length	13.995 mm
memory density	18432 bit
Memory IC Type	OTHER FIFO
memory width	9
Number of functions	1
Number of terminals	32
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2KX9
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	3.56 mm
Maximum standby current	0.002 A
Maximum slew rate	0.12 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.455 mm

MK45H03K65TR Related Products

	MK45H03K65TR	MK45H01K65TR	MK45H02K65TR
Description	2KX9 OTHER FIFO, 65ns, PQCC32, PLASTIC, LCC-32	512X9 OTHER FIFO, 65ns, PQCC32, PLASTIC, LCC-32	1KX9 OTHER FIFO, 65ns, PQCC32, PLASTIC, LCC-32
Parts packaging code	QFJ	QFJ	QFJ
package instruction	PLASTIC, LCC-32	QCCJ,	PLASTIC, LCC-32
Contacts	32	32	32
Reach Compliance Code	not_compliant	unknown	not_compliant
ECCN code	EAR99	EAR99	EAR99
Maximum access time	65 ns	65 ns	65 ns
Other features	RETRANSMIT	RETRANSMIT	RETRANSMIT
period time	80 ns	80 ns	80 ns
JESD-30 code	R-PQCC-J32	R-PQCC-J32	R-PQCC-J32
length	13.995 mm	13.995 mm	13.995 mm
memory density	18432 bit	4608 bit	9216 bit
memory width	9	9	9
Number of functions	1	1	1
Number of terminals	32	32	32
word count	2048 words	512 words	1024 words
character code	2000	512	1000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C
organize	2KX9	512X9	1KX9
Exportable	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.56 mm	3.56 mm	3.56 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD
width	11.455 mm	11.455 mm	11.455 mm
Is it lead-free?	Contains lead	-	Contains lead
Is it Rohs certified?	incompatible	-	incompatible
Maker	STMicroelectronics	-	STMicroelectronics
Maximum clock frequency (fCLK)	12.5 MHz	-	12.5 MHz
JESD-609 code	e0	-	e0
Memory IC Type	OTHER FIFO	-	OTHER FIFO
Encapsulate equivalent code	LDCC32,.5X.6	-	LDCC32,.5X.6
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED
power supply	5 V	-	5 V
Maximum standby current	0.002 A	-	0.002 A
Maximum slew rate	0.12 mA	-	0.12 mA
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED

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