512X9 OTHER FIFO, 65ns, PQCC32, PLASTIC, LCC-32
| Parameter Name | Attribute value |
| Parts packaging code | QFJ |
| package instruction | QCCJ, |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 65 ns |
| Other features | RETRANSMIT |
| period time | 80 ns |
| JESD-30 code | R-PQCC-J32 |
| length | 13.995 mm |
| memory density | 4608 bit |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 512 words |
| character code | 512 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512X9 |
| Exportable | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Certification status | Not Qualified |
| Maximum seat height | 3.56 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 11.455 mm |
| Base Number Matches | 1 |
| MK45H01K65TR | MK45H02K65TR | MK45H03K65TR | |
|---|---|---|---|
| Description | 512X9 OTHER FIFO, 65ns, PQCC32, PLASTIC, LCC-32 | 1KX9 OTHER FIFO, 65ns, PQCC32, PLASTIC, LCC-32 | 2KX9 OTHER FIFO, 65ns, PQCC32, PLASTIC, LCC-32 |
| Parts packaging code | QFJ | QFJ | QFJ |
| package instruction | QCCJ, | PLASTIC, LCC-32 | PLASTIC, LCC-32 |
| Contacts | 32 | 32 | 32 |
| Reach Compliance Code | unknown | not_compliant | not_compliant |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 65 ns | 65 ns | 65 ns |
| Other features | RETRANSMIT | RETRANSMIT | RETRANSMIT |
| period time | 80 ns | 80 ns | 80 ns |
| JESD-30 code | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 |
| length | 13.995 mm | 13.995 mm | 13.995 mm |
| memory density | 4608 bit | 9216 bit | 18432 bit |
| memory width | 9 | 9 | 9 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 |
| word count | 512 words | 1024 words | 2048 words |
| character code | 512 | 1000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 512X9 | 1KX9 | 2KX9 |
| Exportable | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCJ | QCCJ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.56 mm | 3.56 mm | 3.56 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | J BEND | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD |
| width | 11.455 mm | 11.455 mm | 11.455 mm |
| Is it lead-free? | - | Contains lead | Contains lead |
| Is it Rohs certified? | - | incompatible | incompatible |
| Maker | - | STMicroelectronics | STMicroelectronics |
| Maximum clock frequency (fCLK) | - | 12.5 MHz | 12.5 MHz |
| JESD-609 code | - | e0 | e0 |
| Memory IC Type | - | OTHER FIFO | OTHER FIFO |
| Encapsulate equivalent code | - | LDCC32,.5X.6 | LDCC32,.5X.6 |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED |
| power supply | - | 5 V | 5 V |
| Maximum standby current | - | 0.002 A | 0.002 A |
| Maximum slew rate | - | 0.12 mA | 0.12 mA |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED |
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