72V251L15PF datasheet, PDF - EEWORLD Datasheet

72V251L15PF: DescriptionTQFP-32, Tray; Categorystorage storage; File Size314KB，15 Pages; ManufacturerIDT (Integrated Device Technology)

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TQFP-32, Tray

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	TQFP
package instruction	PLASTIC, TQFP-32
Contacts	32
Manufacturer packaging code	PR32
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	10 ns
Maximum clock frequency (fCLK)	66.7 MHz
period time	15 ns
JESD-30 code	S-PQFP-G32
JESD-609 code	e0
length	7 mm
memory density	73728 bit
Memory IC Type	OTHER FIFO
memory width	9
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
word count	8192 words
character code	8000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8KX9
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	TQFP32,.35SQ,32
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.005 A
Maximum slew rate	0.02 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7 mm

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