|
MT4C4256EC-10/883C |
MT4C4256C-12/883C |
MT4C4256EC-12/883C |
MT4C4256C-8/883C |
MT4C4256EC-8/883C |
Description |
Fast Page DRAM, 256KX4, 100ns, CMOS, CDSO20, CERAMIC, LCC-26/20 |
Fast Page DRAM, 256KX4, 120ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, DIP-20 |
Fast Page DRAM, 256KX4, 120ns, CMOS, CDSO20, CERAMIC, LCC-26/20 |
Fast Page DRAM, 256KX4, 80ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, DIP-20 |
Fast Page DRAM, 256KX4, 80ns, CMOS, CDSO20, CERAMIC, LCC-26/20 |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
Micross |
Micross |
Micross |
Micross |
Micross |
Parts packaging code |
DLCC |
DIP |
DLCC |
DIP |
DLCC |
package instruction |
SON, |
0.300 INCH, CERAMIC, DIP-20 |
SON, |
0.300 INCH, CERAMIC, DIP-20 |
SON, SOLCC20/26,.35 |
Contacts |
26 |
20 |
26 |
20 |
26 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
access mode |
FAST PAGE |
FAST PAGE |
FAST PAGE |
FAST PAGE |
FAST PAGE |
Maximum access time |
100 ns |
120 ns |
120 ns |
80 ns |
80 ns |
Other features |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 code |
R-CDSO-N20 |
R-CDIP-T20 |
R-CDSO-N20 |
R-CDIP-T20 |
R-CDSO-N20 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
length |
17.145 mm |
25.4 mm |
17.145 mm |
25.4 mm |
17.145 mm |
memory density |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
1048576 bit |
Memory IC Type |
FAST PAGE DRAM |
FAST PAGE DRAM |
FAST PAGE DRAM |
FAST PAGE DRAM |
FAST PAGE DRAM |
memory width |
4 |
4 |
4 |
4 |
4 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of ports |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
20 |
20 |
20 |
20 |
20 |
word count |
262144 words |
262144 words |
262144 words |
262144 words |
262144 words |
character code |
256000 |
256000 |
256000 |
256000 |
256000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
organize |
256KX4 |
256KX4 |
256KX4 |
256KX4 |
256KX4 |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
SON |
DIP |
SON |
DIP |
SON |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Filter level |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
Maximum seat height |
1.93 mm |
3.93 mm |
1.93 mm |
3.93 mm |
1.93 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
NO |
YES |
NO |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
Terminal surface |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
Terminal form |
NO LEAD |
THROUGH-HOLE |
NO LEAD |
THROUGH-HOLE |
NO LEAD |
Terminal pitch |
1.27 mm |
2.54 mm |
1.27 mm |
2.54 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
8.89 mm |
7.62 mm |
8.89 mm |
7.62 mm |
8.89 mm |