RK80530PZ001256 datasheet, PDF

Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> RK80530PZ001256

RK80530PZ001256: DescriptionRISC Microprocessor, 32-Bit, 1000MHz, CMOS, CPGA370; CategoryThe embedded processor and controller Microcontrollers and processors; File Size891KB，84 Pages; ManufacturerIntel; Websitehttp://www.intel.com/; Environmental Compliance

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RK80530PZ001256 Overview

RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CPGA370

RK80530PZ001256 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Intel
package instruction	PGA, SPGA370,37X37
Reach Compliance Code	compliant
bit size	32
JESD-30 code	S-XPGA-P370
Number of terminals	370
Package body material	CERAMIC
encapsulated code	PGA
Encapsulate equivalent code	SPGA370,37X37
Package shape	SQUARE
Package form	GRID ARRAY
power supply	1.475,1.5/1.8 V
Certification status	Not Qualified
speed	1000 MHz
surface mount	NO
technology	CMOS
Terminal form	PIN/PEG
Terminal pitch	1.27 mm
Terminal location	PERPENDICULAR
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

RK80530PZ001256 Preview

Intel

Pentium

III Processor Based on 0.13

Micron Process Up to 1.33 GHz

Datasheet

Available at 1.0, 1.13, 1.20, 1.33 GHz.

System bus frequency at 133 MHz

256 KB Advanced Transfer Cache (on-die,

full speed Level 2 (L2) cache with Error

Correcting Code (ECC))

Dual Independent Bus (DIB) architecture:

Separate dedicated external System Bus and

dedicated internal high-speed cache bus

Internet Streaming SIMD Extensions for

enhanced video, sound and 3D performance

Binary compatible with applications running

on previous members of the Intel

microprocessor line

Dynamic execution micro architecture

Data Prefetch Logic

8-way cache associativity provides improved

cache hit rate on reads/store operations.

Power Management capabilities

— System Management mode

— Multiple low-power states

Optimized for 32-bit applications running on

advanced 32-bit operating systems

Flip Chip Pin Grid Array (FC-PGA2) packaging

technology; FC-PGA2 processors deliver high

performance with improved handling protection

and socketability

Integrated high performance 16 KB instruction

and 16 KB data, nonblocking, level one cache

256 KB Integrated Full Speed level two cache

allows for low latency on read/store operations

Quad Quadword Wide (256 bit) cache data bus

provides extremely high throughput on read/

store operations.

Error-correcting code for System Bus data

The Intel

Pentium

III

processor based on 0.13 micron process is designed for high-performance

desktops and for workstations and servers. It is binary compatible with previous Intel Architecture

processors. The Pentium

III

processor on 0.13 micron process provides great performance for

applications running on advanced operating systems such as Windows* 98, Windows NT*, Windows*

2000, Windows Me*, Windows XP*, and Linux. This is achieved by integrating the best attributes of

Intel processors—the dynamic execution, Dual Independent Bus architecture plus Intel MMX™

technology and Internet Streaming SIMD Extensions—bringing a new level of performance for systems

buyers. The Pentium

III

processor based on 0.13 micron process extends the power of the Pentium

III

processor with performance headroom for business media, communication and internet capabilities.

Systems based on Pentium

III

processors based on 0.13 micron process also include the latest features

to simplify system management and lower the cost of ownership for large and small business

environments. The Pentium

III

processor based on 0.13 micron process offers great performance for

today’s and tomorrow’s applications.

December 2001

Document Number:

249765-002

Information in this document is provided in connection with Intel

products. No license, express or implied, by estoppel or otherwise, to any intellectual

property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability

whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to

fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not

intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

Pentium

III processor may contain design defects or errors known as errata which may cause the product to deviate from published spec-

ifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained by calling

1-800-548-4725 or by visiting Intel’s website at http://www.intel.com.

Intel, Celeron, Pentium, and MMX are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other coun-

tries.

*Other names and brands may be claimed as the property of others.

2001, Intel Corporation

Datasheet

Intel

Pentium

III Processor Based on 0.13 Micron Process Up to 1.33 GHz

Contents

1.0

Introduction......................................................................................................................... 9

1.1

Terminology.........................................................................................................10

1.1.1 Package and Processor Terminology ....................................................10

1.1.2 Processor Naming Convention...............................................................11

Related Documents.............................................................................................11

Processor System Bus and V

REF

........................................................................12

Clock Control and Low Power States..................................................................13

2.2.1 Normal State—State 1 ...........................................................................14

2.2.2 AutoHALT Powerdown State—State 2...................................................14

2.2.3 Stop-Grant State—State 3 .....................................................................14

2.2.4 HALT/Grant Snoop State—State 4 ........................................................15

2.2.5 Sleep State—State 5..............................................................................15

2.2.6 Deep Sleep State—State 6 ....................................................................15

2.2.7 Clock Control..........................................................................................16

Power and Ground Pins ......................................................................................16

2.3.1 Phase Lock Loop (PLL) Power...............................................................17

Decoupling Guidelines ........................................................................................17

2.4.1 Processor VCC

CORE

Decoupling............................................................17

Processor System Bus Clock and Processor Clocking .......................................18

Voltage Identification ...........................................................................................19

Processor System Bus Unused Pins...................................................................22

Processor System Bus Signal Groups ................................................................22

2.8.1 Asynchronous vs. Synchronous for System Bus Signals .......................23

2.8.2 System Bus Frequency Select Signals ..................................................24

Test Access Port (TAP) Connection....................................................................25

Maximum Ratings................................................................................................25

Processor Voltage Level Specifications ..............................................................25

AGTL System Bus Specifications........................................................................30

System Bus Timing Specifications ......................................................................31

BCLK/BCLK# & PICCLK Signal Quality Specifications and

Measurement Guidelines ....................................................................................42

AGTL Signal Quality Specifications and Measurement Guidelines.....................43

3.2.1 Overshoot/Undershoot Guidelines .........................................................44

3.2.1.1 Overshoot/Undershoot Magnitude ............................................44

3.2.1.2 Overshoot/Undershoot Pulse Duration......................................45

3.2.1.3 Activity Factor ............................................................................45

3.2.1.4 Reading Overshoot/Undershoot Specification Tables...............46

3.2.1.5 Determining if a System Meets the Overshoot/Undershoot

Specifications ............................................................................47

Non-AGTL Signal Quality Specifications and Measurement Guidelines.............48

3.3.1 Overshoot/Undershoot Guidelines .........................................................49

3.3.2 Ringback Specification ...........................................................................50

3.3.3 Settling Limit Guideline...........................................................................50

1.2

2.0

2.1

2.2

Electrical Specifications....................................................................................................12

2.3

2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

3.0

3.1

3.2

Signal Quality Specifications ............................................................................................42

3.3

Datasheet

Intel

Pentium

III Processor Based on 0.13 Micron Process Up to 1.33 GHz

4.0

Thermal Specifications and Design Considerations......................................................... 51

4.1

Thermal Specifications........................................................................................ 51

4.1.1 THERMTRIP# Requirement................................................................... 51

4.1.2 Thermal Diode........................................................................................ 52

Thermal Metrology .............................................................................................. 52

FC-PGA2 Mechanical Specifications .................................................................. 53

Recommended Mechanical Keep-Out Zones ..................................................... 55

Processor Markings ............................................................................................ 56

Processor Signal Listing...................................................................................... 57

Mechanical Specifications................................................................................... 69

6.1.1 Mechanical Specifications for the FC-PGA2 Package ........................... 69

6.1.2 Boxed Processor Heatsink Weight......................................................... 70

Thermal Specifications........................................................................................ 71

6.2.1 Boxed Processor Cooling Requirements ............................................... 71

6.2.2 Boxed Processor Thermal Cooling Solution Clip ................................... 71

Electrical Requirements for the Boxed Intel

Pentium

III Processor

Based on 0.13 micron Process ........................................................................... 72

6.3.1 Electrical Requirements ......................................................................... 72

Alphabetical Signals Reference .......................................................................... 74

Signal Summaries ............................................................................................... 81

4.2

5.0

5.1

5.2

5.3

5.4

6.0

6.1

Mechanical Specifications................................................................................................ 53

Boxed Processor Specifications....................................................................................... 68

6.2

6.3

7.0

Processor Signal Description ........................................................................................... 74

7.1

7.2

Datasheet

Intel

Pentium

III Processor Based on 0.13 Micron Process Up to 1.33 GHz

Figures

Integrated Heat Spreader (IHS) ............................................................................ 9

AGTL Bus Topology in a Uniprocessor Configuration.........................................13

Stop Clock State Machine ...................................................................................13

PLL Filter Specification........................................................................................17

Differential/Single-Ended Clocking Example.......................................................18

Power Good and Bus Select Interconnect Diagram .....................................21

BSEL[1:0] Example for a System Design............................................................24

Vcc Static and Transient Tolerance ....................................................................28

Clock Waveform ..................................................................................................36

BCLK/BCLK#, PICCLK, and TCK Generic Clock Waveform ..............................37

System Bus Valid Delay Timings ........................................................................37

System Bus Setup and Hold Timings..................................................................38

System Bus Reset and Configuration Timings....................................................38

Platform Power-On Sequence and Timings ........................................................39

Power-On Reset and Configuration Timings.......................................................40

Test Timings (TAP Connection) ..........................................................................40

Test Reset Timings .............................................................................................41

BCLK/BCLK#, PICCLK Generic Clock Waveform at the Processor Pins ...........43

Low to High AGTL Receiver Ringback Tolerance...............................................44

Maximum Acceptable AGTL Overshoot/Undershoot Waveform .........................48

Non-AGTL Overshoot/Undershoot, Settling Limit, and Ringback ......................48

Package Dimensions...........................................................................................53

Volumetric Keep-Out ...........................................................................................55

Component Keep-Out .........................................................................................55

Top Side Processor Markings .............................................................................56

Intel

Pentium

III Processor Based on 0.13 micron Process Pinout .................57

Conceptual Boxed Intel

Pentium

III Processor Based on 0.13 micron

Process for the PGA370 Socket..........................................................................68

Comparison between FC-PGA and FC-PGA2 package......................................69

Side View of Space Requirements for the Boxed Processor ..............................70

Dimensions of Mechanical Step Feature in Heatsink Base.................................70

Thermal Airspace Requirement for all Boxed Intel

Pentium

III Processor

Based on 0.13 micron Process Fan Heatsinks in the PGA370 Socket ...............71

Boxed Processor Fan Heatsink Power Cable Connector Description.................72

Motherboard Power Header Placement Relative to the Boxed

Intel

Pentium

III Processor Based on 0.13 micron Process ............................73

Datasheet

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