Ver 201305
'LMT &IEH
*SV )1- 7YTTVIWWMSR
CIB/CIM05 Series (1005/ EIA 0402)
APPLICATION
High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
FEATURES
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow
or reflow soldering
Monolithic inorganic material construction for high reliability
Closed magnetic circuit configuration avoids crosstalk and is
suitable for high density PCBs.
RECOMMENDED LAND PATTERN
0.45~0.55mm
0.45~0.55mm
0.40~0.50mm
0.40~0.50mm
DIMENSION
Type
Dimension [mm]
L
W
t
d
05
1.0±0.05 0.5±0.05 0.5±0.05 0.25±0.1
DESCRIPTION
Thickness
(mm)
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
Impedance
(Ω)±25%@100MHz
10
10
30
60
80
120
220
240
300
470
600
1000
30
60
80
120
220
240
300
470
600
DC Resistance
(Ω) Max.
0.05
0.05
0.10
0.15
0.20
0.25
0.35
0.35
0.45
0.55
0.60
0.80
0.20
0.20
0.25
0.25
0.35
0.35
0.45
0.55
0.60
Rated Current
(mA) Max.
1200
1200
700
600
600
600
500
400
400
300
300
300
700
650
600
500
400
400
400
300
300
Part no.
CIB05J100
CIM05U100
CIM05U300
CIM05U600
CIM05U800
CIM05U121
CIM05U221
CIM05U241
CIM05U301
CIM05U471
CIM05U601
CIM05U102
CIM05J300
CIM05J600
CIM05J800
CIM05J121
CIM05J221
CIM05J241
CIM05J301
CIM05J471
CIM05J601
Ver 201305
PRODUCT IDENTIFICATION
CI
(1)
(1)
(3)
(5)
(6)
(7)
M
(2)
05
(3)
U
(4)
121
(5)
N
(6)
C
(7)
Chip Beads
(2) M: Multi-layer type B:Mono-layer type
Dimension
(4) Material Code
Nominal impedance (100:10Ω, 121:120Ω )
Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
Packaging(C:paper tape, E:embossed tape)
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
FLOW SOLDERING
PACKAGING
Packaging Style
Card Board Taping
Quantity(pcs/reel)
10,000
Any data in this sheet are subject to change, modify or discontinue without notice.
The data sheets include the typical data for design reference only. If there is any question regarding the
data sheets, please contact our sales personnel or application engineers.