FIFO, 64KX9, 25ns, Asynchronous, CMOS, CDIP28
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
package instruction | DIP, DIP28,.6 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 25 ns |
Maximum clock frequency (fCLK) | 28.6 MHz |
JESD-30 code | R-XDIP-T28 |
JESD-609 code | e0 |
memory density | 589824 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Number of terminals | 28 |
word count | 65536 words |
character code | 64000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64KX9 |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.032 A |
Maximum slew rate | 0.56 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |