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WED3C7410E16M-450BHI

Description
RISC Microprocessor, 450MHz, CMOS, CBGA255, 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size442KB,15 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric View All

WED3C7410E16M-450BHI Overview

RISC Microprocessor, 450MHz, CMOS, CBGA255, 21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255

WED3C7410E16M-450BHI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction21 X 25 MM, 3.20 MM HEIGHT, CERAMIC, BGA-255
Reach Compliance Codeunknown
Address bus width64
boundary scanYES
maximum clock frequency133 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeR-CBGA-B255
low power modeYES
Number of terminals255
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height2.652 mm
speed450 MHz
Maximum supply voltage1.9 V
Minimum supply voltage1.7 V
Nominal supply voltage1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
White Electronic Designs
WED3C7410E16M-XBHX
7410E RISC Microprocessor HiTCE™ Multichip Package
OVERVIEW
The WEDC 7410E/SSRAM multichip package is targeted
for high performance, space sensitive, low power systems
and supports the following power management features:
doze, nap, sleep and dynamic power management.
The WED3C7410E16M-XBHX multichip package consists
of:
7410E AltiVec™ RISC processor
Dedicated 2MB SSRAM L2 cache, configured as
256Kx72
21mmx25mm, 255 HiTCE™ Ball Grid Array (CBGA)
Core frequency = 450 or 400MHz
Maximum L2 Cache frequency = 200MHz
Maximum 60x Bus frequency = 133MHz**
* This product is subject to change without notice.
** At a maximum of 60x bus frequency of 133MHz, the maximum configuration core
frequency is 400MHz.
The WED3C7410E16M-XBHX is offered in Commercial
(0°C to +70°C), industrial (-40°C to +85°C) and military
(-55°C to +125°C) temperature ranges and is well suited
for embedded applications such as missiles, aerospace,
flight computers, fire control systems and rugged critical
systems.
FEATURES
Footprint compatible with WED3C7410E16M-XBX,
WED3C7558M-XBX and WED3C750A8M-200BX
Implementation of Altivec™ technology instruction
set
Optional, high-bandwidth MPX bus interface
HiTCE™ interposer for TCE compatibility to
laminate substrates for increased Board level
reliability
Available with eutectic or high lead solder balls
FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM
AltiVec™ is a trademark of Motorola Inc.
HiTCE™ is a trademark of Kyocera Corp.
June 2006
Rev. 1
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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