11A, 100V, 0.35ohm, P-CHANNEL, Si, POWER, MOSFET, TO-3, HERMETIC SEALED, METAL, TO-3, 2 PIN
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | SEMELAB |
Parts packaging code | TO-204AA |
package instruction | FLANGE MOUNT, O-MBFM-P2 |
Contacts | 2 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Avalanche Energy Efficiency Rating (Eas) | 81 mJ |
Shell connection | DRAIN |
Configuration | SINGLE |
Minimum drain-source breakdown voltage | 100 V |
Maximum drain current (ID) | 11 A |
Maximum drain-source on-resistance | 0.35 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code | TO-3 |
JESD-30 code | O-MBFM-P2 |
Number of components | 1 |
Number of terminals | 2 |
Operating mode | ENHANCEMENT MODE |
Maximum operating temperature | 150 °C |
Package body material | METAL |
Package shape | ROUND |
Package form | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | P-CHANNEL |
Maximum pulsed drain current (IDM) | 50 A |
Certification status | Not Qualified |
surface mount | NO |
Terminal form | PIN/PEG |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Transistor component materials | SILICON |
IRF9130-JQR-B | IRF9130R1 | IRF9130-JQR-BR1 | IRF9130-QR-B | |
---|---|---|---|---|
Description | 11A, 100V, 0.35ohm, P-CHANNEL, Si, POWER, MOSFET, TO-3, HERMETIC SEALED, METAL, TO-3, 2 PIN | 11A, 100V, 0.35ohm, P-CHANNEL, Si, POWER, MOSFET, TO-3, HERMETIC SEALED, METAL, TO-3, 2 PIN | 11A, 100V, 0.35ohm, P-CHANNEL, Si, POWER, MOSFET, TO-3, HERMETIC SEALED, METAL, TO-3, 2 PIN | 11A, 100V, 0.35ohm, P-CHANNEL, Si, POWER, MOSFET, TO-3, HERMETIC SEALED, METAL, TO-3, 2 PIN |
Is it lead-free? | Contains lead | Lead free | Lead free | Contains lead |
Is it Rohs certified? | incompatible | conform to | conform to | incompatible |
Maker | SEMELAB | SEMELAB | SEMELAB | SEMELAB |
Parts packaging code | TO-204AA | TO-204AA | TO-204AA | TO-204AA |
package instruction | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 |
Contacts | 2 | 2 | 2 | 2 |
Reach Compliance Code | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Avalanche Energy Efficiency Rating (Eas) | 81 mJ | 81 mJ | 81 mJ | 81 mJ |
Shell connection | DRAIN | DRAIN | DRAIN | DRAIN |
Configuration | SINGLE | SINGLE | SINGLE | SINGLE |
Minimum drain-source breakdown voltage | 100 V | 100 V | 100 V | 100 V |
Maximum drain current (ID) | 11 A | 11 A | 11 A | 11 A |
Maximum drain-source on-resistance | 0.35 Ω | 0.35 Ω | 0.35 Ω | 0.35 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code | TO-3 | TO-3 | TO-3 | TO-3 |
JESD-30 code | O-MBFM-P2 | O-MBFM-P2 | O-MBFM-P2 | O-MBFM-P2 |
Number of components | 1 | 1 | 1 | 1 |
Number of terminals | 2 | 2 | 2 | 2 |
Operating mode | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C |
Package body material | METAL | METAL | METAL | METAL |
Package shape | ROUND | ROUND | ROUND | ROUND |
Package form | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Polarity/channel type | P-CHANNEL | P-CHANNEL | P-CHANNEL | P-CHANNEL |
Maximum pulsed drain current (IDM) | 50 A | 50 A | 50 A | 50 A |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | NO | NO | NO |
Terminal form | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Transistor component materials | SILICON | SILICON | SILICON | SILICON |