AM28C256-305DC datasheet, PDF - EEWORLD Datasheet

AM28C256-305DC: DescriptionEEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28; Categorystorage storage; File Size359KB，11 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM28C256-305DC Overview

EEPROM, 32KX8, 300ns, Parallel, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28

Parameter Name	Attribute value
Maker	AMD
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	300 ns
JESD-30 code	R-GDIP-T28
length	37.1475 mm
memory density	262144 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	5.588 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

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