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HD63B21P

Description
Parallel I/O Port, 16 I/O, CMOS, PDIP40, PLASTIC, DIP-40
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size838KB,25 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
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HD63B21P Overview

Parallel I/O Port, 16 I/O, CMOS, PDIP40, PLASTIC, DIP-40

HD63B21P Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerHitachi (Renesas )
Parts packaging codeDIP
package instructionDIP, DIP40,.6
Contacts40
Reach Compliance Codeunknown
ECCN codeEAR99
maximum clock frequency2 MHz
External data bus width8
JESD-30 codeR-PDIP-T40
JESD-609 codee0
length52.8 mm
Number of I/O lines16
Number of ports2
Number of terminals40
Maximum operating temperature75 °C
Minimum operating temperature-20 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum slew rate6 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL EXTENDED
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
uPs/uCs/peripheral integrated circuit typePARALLEL IO PORT, GENERAL PURPOSE

HD63B21P Related Products

HD63B21P HD6321P HD6821P HD63A21P HD63A21FP HD63B21FP HD6321FP
Description Parallel I/O Port, 16 I/O, CMOS, PDIP40, PLASTIC, DIP-40 Parallel I/O Port, 16 I/O, CMOS, PDIP40, PLASTIC, DIP-40 Parallel I/O Port, 16 I/O, NMOS, PDIP40, PLASTIC, DIP-40 Parallel I/O Port, 16 I/O, CMOS, PDIP40, PLASTIC, DIP-40 Parallel I/O Port, 16 I/O, CMOS, PQFP54, PLASTIC, FP-54 Parallel I/O Port, 16 I/O, CMOS, PQFP54, PLASTIC, FP-54 Parallel I/O Port, 16 I/O, CMOS, PQFP54, PLASTIC, FP-54
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code DIP DIP DIP DIP QFP QFP QFP
package instruction DIP, DIP40,.6 PLASTIC, DIP-40 PLASTIC, DIP-40 PLASTIC, DIP-40 PLASTIC, FP-54 PLASTIC, FP-54 PLASTIC, FP-54
Contacts 40 40 40 40 54 54 54
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
maximum clock frequency 2 MHz 1 MHz 1 MHz 1.5 MHz 1.5 MHz 2 MHz 1 MHz
External data bus width 8 8 8 8 8 8 8
JESD-30 code R-PDIP-T40 R-PDIP-T40 R-PDIP-T40 R-PDIP-T40 R-PQFP-G54 R-PQFP-G54 R-PQFP-G54
JESD-609 code e0 e0 e0 e0 e0 e0 e0
length 52.8 mm 52.8 mm 52.8 mm 52.8 mm 20 mm 20 mm 20 mm
Number of I/O lines 16 16 16 16 16 16 16
Number of ports 2 2 2 2 2 2 2
Number of terminals 40 40 40 40 54 54 54
Maximum operating temperature 75 °C 75 °C 75 °C 75 °C 75 °C 75 °C 75 °C
Minimum operating temperature -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP QFP QFP QFP
Encapsulate equivalent code DIP40,.6 DIP40,.6 DIP40,.6 DIP40,.6 QFP54,.77X1.0,40 QFP54,.77X1.0,40 QFP54,.77X1.0,40
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE FLATPACK FLATPACK FLATPACK
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 5.08 mm 5.08 mm 5.08 mm 2.9 mm 2.9 mm 2.9 mm
Maximum slew rate 6 mA 4 mA 4 mA 5 mA 5 mA 6 mA 4 mA
Maximum supply voltage 5.5 V 5.5 V 5.25 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.75 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO YES YES YES
technology CMOS CMOS NMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1 mm 1 mm 1 mm
Terminal location DUAL DUAL DUAL DUAL QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 15.24 mm 15.24 mm 15.24 mm 14 mm 14 mm 14 mm
uPs/uCs/peripheral integrated circuit type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Maker Hitachi (Renesas ) - Hitachi (Renesas ) - - Hitachi (Renesas ) Hitachi (Renesas )
Base Number Matches - 1 1 1 1 - -

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