Consumer Circuit, CMOS, CQFP304, 40 MM, CERAMIC, QFP-304
Parameter Name | Attribute value |
Maker | IBM |
Parts packaging code | QFP |
package instruction | FQFP, |
Contacts | 304 |
Reach Compliance Code | unknown |
Commercial integrated circuit types | CONSUMER CIRCUIT |
JESD-30 code | S-CQFP-G304 |
length | 40 mm |
Number of functions | 1 |
Number of terminals | 304 |
Maximum operating temperature | 40 °C |
Minimum operating temperature | |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | FQFP |
Package shape | SQUARE |
Package form | FLATPACK, FINE PITCH |
Certification status | Not Qualified |
Maximum seat height | 3.15 mm |
Maximum supply voltage (Vsup) | 3.502 V |
Minimum supply voltage (Vsup) | 3.298 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
width | 40 mm |
IBM39MPEGSE11CFD16C | IBM39MPEGME31CFB16C | IBM39MPEGSE31CFB16C | IBM39MPEGSE21CFB16C | |
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Description | Consumer Circuit, CMOS, CQFP304, 40 MM, CERAMIC, QFP-304 | Consumer Circuit, CMOS, CQFP304, 40 MM, CERAMIC, QFP-304 | Consumer Circuit, CMOS, CQFP304, 40 MM, CERAMIC, QFP-304 | Consumer Circuit, CMOS, CQFP304, 40 MM, CERAMIC, QFP-304 |
Maker | IBM | IBM | IBM | IBM |
Parts packaging code | QFP | QFP | QFP | QFP |
package instruction | FQFP, | FQFP, | FQFP, | FQFP, |
Contacts | 304 | 304 | 304 | 304 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Commercial integrated circuit types | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
JESD-30 code | S-CQFP-G304 | S-CQFP-G304 | S-CQFP-G304 | S-CQFP-G304 |
length | 40 mm | 40 mm | 40 mm | 40 mm |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 304 | 304 | 304 | 304 |
Maximum operating temperature | 40 °C | 40 °C | 40 °C | 40 °C |
Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | FQFP | FQFP | FQFP | FQFP |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.15 mm | 3.15 mm | 3.15 mm | 3.15 mm |
Maximum supply voltage (Vsup) | 3.502 V | 3.502 V | 3.502 V | 3.502 V |
Minimum supply voltage (Vsup) | 3.298 V | 3.298 V | 3.298 V | 3.298 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD |
width | 40 mm | 40 mm | 40 mm | 40 mm |