EMVA13AB3-14.318MTR datasheet, PDF

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EMVA13AB3-14.318MTR: DescriptionVCXO, CLOCK, 14.318 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, SMD, 4 PIN; CategoryPassive components oscillator; File Size197KB，6 Pages; ManufacturerECLIPTEK; Websitehttp://www.ecliptek.com; Environmental Compliance

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EMVA13AB3-14.318MTR Overview

VCXO, CLOCK, 14.318 MHz, LVCMOS OUTPUT, ROHS COMPLIANT, SMD, 4 PIN

EMVA13AB3-14.318MTR Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ECLIPTEK
package instruction	ROHS COMPLIANT, SMD, 4 PIN
Reach Compliance Code	compliant
Other features	TAPE AND REEL
Maximum control voltage	1.8 V
Minimum control voltage
maximum descent time	2 ns
Frequency Adjustment - Mechanical	NO
Frequency offset/pull rate	80 ppm
frequency stability	50%
JESD-609 code	e4
linearity	1%
Manufacturer's serial number	EMVA13
Installation features	SURFACE MOUNT
Nominal operating frequency	14.318 MHz
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Oscillator type	LVCMOS
Output load	15 pF
physical size	7.0mm x 5.0mm x 0.85mm
longest rise time	2 ns
Maximum supply voltage	3.63 V
Minimum supply voltage	2.97 V
Nominal supply voltage	3.3 V
surface mount	YES
maximum symmetry	55/45 %
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)

EMVA13AB3-14.318MTR Preview

EMVA13AB3-14.318M TR

Series

RoHS Compliant (Pb-free) 4 Pad 5mm x 7mm SMD

3.3Vdc LVCMOS Voltage Controlled MEMS Oscillator

Frequency Tolerance/Stability

±50ppm Maximum

Operating Temperature Range

-40°C to +85°C

RoHS

Packaging Options

Tape & Reel

EMVA13 A B 3 -14.318M TR

Nominal Frequency

14.318MHz

Absolute Pull Range

±80ppm Minimum

ELECTRICAL SPECIFICATIONS

Nominal Frequency

Frequency Tolerance/Stability

14.318MHz

±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,

260°C Reflow, Shock, and Vibration)

±1ppm Maximum First Year

-40°C to +85°C

3.3Vdc ±10%

15mA Maximum

90% of Vdd Minimum (IOH = -4mA)

10% of Vdd Maximum (IOL = +4mA)

2nSec Maximum (Measured from 20% to 80% of waveform)

50 ±5(%) (Measured at 50% of waveform)

15pF Maximum

CMOS

±80ppm Minimum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Operating Temperature Range, Supply Voltage Change, Output Load Change, Shock, Vibration, and First

Year Aging at 25°C over the Control Voltage (Vc).)

0.05Vdc to 1.7Vdc (Test Condition for APR)

0.0Vdc to 1.8Vdc

1% Maximum

Positive Transfer Characteristic

8kHz Typical, 5kHz Minimum (Measured at -3dB, Vc = 0.875Vdc)

250kOhms Minimum

10µA Maximum

-100dBc/Hz at offset of 10kHz, -115dBc/Hz at offset of 100kHz, -145dBc/Hz at offset of 1MHz, and -

154dBc/Hz at offset of 10MHz

3pSec Typical, 6pSec Maximum

20pSec Typical, 40pSec Maximum

0.8pSec Typical

0.6pSec Typical

10mSec Maximum

-55°C to +125°C

Aging at 25°C

Operating Temperature Range

Supply Voltage

Input Current

Output Voltage Logic High (Voh)

Output Voltage Logic Low (Vol)

Rise/Fall Time

Duty Cycle

Load Drive Capability

Output Logic Type

Absolute Pull Range

Control Voltage

Control Voltage Range

Linearity

Transfer Function

Modulation Bandwidth

Input Impedance

Input Leakage Current

Typical Phase Noise at Offsets

Period Jitter (RMS)

Period Jitter (pk-pk)

RMS Phase Jitter (Fj = 1.875MHz to

20MHz; Random)

RMS Phase Jitter (Fj = 900kHz to

7.5MHz; Random)

Start Up Time

Storage Temperature Range

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

ESD Susceptibility

Flammability

Mechanical Shock

Moisture Resistance

Moisture Sensitivity Level

Resistance to Soldering Heat

Resistance to Solvents

Solderability

MIL-STD-883, Method 3015, Class 2, HBM 2000V

UL94-V0

MIL-STD-883, Method 2002, Condition G, 30,000G

MIL-STD-883, Method 1004

J-STD-020, MSL 1

MIL-STD-202, Method 210, Condition K

MIL-STD-202, Method 215

MIL-STD-883, Method 2003 (Four I/O Pads on bottom of package only)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 1 of 6

EMVA13AB3-14.318M TR

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Temperature Cycling

Thermal Shock

Vibration

MIL-STD-883, Method 1010, Condition B

MIL-STD-883, Method 1011, Condition B

MIL-STD-883, Method 2007, Condition A, 20G

MECHANICAL DIMENSIONS (all dimensions in millimeters)

CONNECTION

Control Voltage

Case Ground

Output

Supply Voltage

5.00

±0.15

0.85

±0.15

0.08

MAX

1.20 ±0.10 (x4)

2.1

R0.70 ±0.10

1.70

LINE MARKING

7.00

±0.15

5.08

±0.10

C0.25 ±0.10

2.60 ±0.15

XXXX or XXXXX

XXXX or XXXXX=Ecliptek

Manufacturing Lot Code

1.40

±0.10 (x4)

Note A: Center paddle is connected

internally to oscillator ground (Pad 2).

Suggested Solder Pad Layout

All Dimensions in Millimeters

2.0 (X4)

2.2 (X4)

2.88

Solder Land

(X4)

1.81

All Tolerances are ±0.1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 2 of 6

EMVA13AB3-14.318M TR

OUTPUT WAVEFORM

CLOCK OUTPUT

80% of Waveform

50% of Waveform

20% of Waveform

Fall

Time

Rise

Time

Duty Cycle (%) = T

/T x 100

Test Circuit for CMOS Output

Oscilloscope

Frequency

Counter

Current

Meter

Power

Supply

Voltage

Meter

0.01µF

(Note 1)

0.1µF

(Note 1)

Supply

Voltage

)

Probe

(Note 2)

Output

Ground

Voltage

Control

(Note 3)

Power

Supply

Voltage

Meter

Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency

ceramic bypass capacitor close to the package ground and V

pin is required.

Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth

(>300MHz) passive probe is recommended.

Note 3: Capacitance value C

includes sum of all probe and fixture capacitance.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 3 of 6

EMVA13AB3-14.318M TR

Tape & Reel Dimensions

Quantity Per Reel: 1,000 units

4.0 ±0.2

2.0 ±0.2

DIA 1.5 ±0.1

0.30 ±0.05

7.5 ±0.2

16.0 ±0.3

6.75 ±0.20

A0*

8.0 ±0.2

*Compliant to EIA 481A

B0*

K0*

1.5 MIN

DIA 40 MIN

Access Hole at

Slot Location

22.4 MAX

180 MAX

DIA 50 MIN

DIA 20.2 MIN

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

16.4 +2.0/-0

DIA 13.0 ±0.2

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 4 of 6

EMVA13AB3-14.318M TR

Recommended Solder Reflow Methods

Critical Zone

to T

Ramp-up

Ramp-down

Temperature (T)

Max

Min

Preheat

t 25°C to Peak

Time (t)

High Temperature Infrared/Convection

MAX to T

(Ramp-up Rate)

Preheat

- Temperature Minimum (T

MIN)

- Temperature Typical (T

TYP)

- Temperature Maximum (T

MAX)

- Time (t

MIN)

Ramp-up Rate (T

to T

)

Time Maintained Above:

- Temperature (T

)

- Time (t

)

Peak Temperature (T

)

Target Peak Temperature (T

Target)

Time within 5°C of actual peak (t

)

Ramp-down Rate

Time 25°C to Peak Temperature (t)

Moisture Sensitivity Level

3°C/second Maximum

150°C

175°C

200°C

60 - 180 Seconds

3°C/second Maximum

217°C

60 - 150 Seconds

260°C Maximum for 10 Seconds Maximum

250°C +0/-5°C

20 - 40 seconds

6°C/second Maximum

8 minutes Maximum

Level 1

www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 3/12/2011 | Page 5 of 6

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