SMC62L82F5 datasheet, PDF - EEWORLD Datasheet

SMC62L82F5: DescriptionIC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size672KB，8 Pages; ManufacturerSeiko Epson Corporation

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SMC62L82F5 Overview

IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Seiko Epson Corporation
package instruction	QFP, QFP80,.75X1,32
Reach Compliance Code	unknown
bit size	4
CPU series	E0C6200/SMC6200
JESD-30 code	R-PQFP-G80
JESD-609 code	e0
Negative supply voltage rating	-1.5 V
Number of terminals	80
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP80,.75X1,32
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	-1.5 V
Certification status	Not Qualified
RAM (bytes)	112
rom(word)	2048
ROM programmability	MROM
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	QUAD

	SMC62L82F5	SMC62A82F14	SMC62A82F5
Description	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC	IC,MICROCONTROLLER,4-BIT,E0C6200/SMC6200 CPU,CMOS,QFP,80PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Seiko Epson Corporation	Seiko Epson Corporation	Seiko Epson Corporation
package instruction	QFP, QFP80,.75X1,32	QFP, QFP80,.55SQ,20	QFP, QFP80,.75X1,32
Reach Compliance Code	unknown	unknown	unknown
bit size	4	4	4
CPU series	E0C6200/SMC6200	E0C6200/SMC6200	E0C6200/SMC6200
JESD-30 code	R-PQFP-G80	S-PQFP-G80	R-PQFP-G80
JESD-609 code	e0	e0	e0
Negative supply voltage rating	-1.5 V	-3 V	-3 V
Number of terminals	80	80	80
Maximum operating temperature	70 °C	70 °C	70 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QFP	QFP
Encapsulate equivalent code	QFP80,.75X1,32	QFP80,.55SQ,20	QFP80,.75X1,32
Package shape	RECTANGULAR	SQUARE	RECTANGULAR
Package form	FLATPACK	FLATPACK	FLATPACK
power supply	-1.5 V	-3 V	-3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	112	112	112
rom(word)	2048	2048	2048
ROM programmability	MROM	MROM	MROM
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.5 mm	0.8 mm
Terminal location	QUAD	QUAD	QUAD

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