Flash, 4MX8, 90ns, PBGA57, PLASTIC, FBGA-57
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | FUJITSU |
| package instruction | TFBGA, BGA56,8X12,32 |
| Reach Compliance Code | unknown |
| ECCN code | 3A991.B.1.A |
| Maximum access time | 90 ns |
| Other features | CONFIGURABLE AS 2M X 16 |
| Spare memory width | 8 |
| startup block | BOTTOM |
| command user interface | YES |
| Universal Flash Interface | YES |
| Data polling | YES |
| JESD-30 code | R-PBGA-B57 |
| JESD-609 code | e0 |
| length | 13.95 mm |
| memory density | 33554432 bit |
| Memory IC Type | FLASH |
| memory width | 8 |
| Number of functions | 1 |
| Number of departments/size | 8,63 |
| Number of terminals | 57 |
| word count | 4194304 words |
| character code | 4000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 4MX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Encapsulate equivalent code | BGA56,8X12,32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| power supply | 3/3.3 V |
| Programming voltage | 3 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Maximum seat height | 1.2 mm |
| Department size | 8K,64K |
| Maximum standby current | 0.000005 A |
| Maximum slew rate | 0.053 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| switch bit | YES |
| type | NOR TYPE |
| width | 7.95 mm |
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