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SST29VE512A-250-4C-NH

Description
EEPROM, 64KX8, 250ns, Parallel, CMOS, PQCC32
Categorystorage    storage   
File Size250KB,26 Pages
ManufacturerSilicon Laboratories Inc
Download Datasheet Parametric Compare View All

SST29VE512A-250-4C-NH Overview

EEPROM, 64KX8, 250ns, Parallel, CMOS, PQCC32

SST29VE512A-250-4C-NH Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSilicon Laboratories Inc
package instructionQCCJ, LDCC32,.5X.6
Reach Compliance Codeunknown
Maximum access time250 ns
command user interfaceNO
Data pollingYES
Durability10000 Write/Erase Cycles
JESD-30 codeR-PQCC-J32
JESD-609 codee0
memory density524288 bit
Memory IC TypeEEPROM
memory width8
Number of terminals32
word count65536 words
character code64000
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX8
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
page size128 words
Parallel/SerialPARALLEL
power supply3/3.3 V
Certification statusNot Qualified
Maximum standby current0.000015 A
Maximum slew rate0.015 mA
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
switch bitYES
Maximum write cycle time (tWC)10 ms
512 Kilobit (64K x 8) Page Mode EEPROM
SST29EE512A / SST29LE512A / SST29VE512A
Data Sheet
FEATURES:
• Single Voltage Read and Write Operations
– 5.0V-only for SST29EE512A
– 3.0-3.6V for SST29LE512A
– 2.7-3.6V for SST29VE512A
• Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
• Low Power Consumption
– Active Current: 20 mA (typical) for 5V and
10 mA (typical) for 3.0/2.7V
– Standby Current: 10 µA (typical)
• Fast Page Write Operation
– 128 Bytes per Page, 512 Pages
– Page Write Cycle: 5 ms (typical)
– Complete Memory Rewrite: 2.5 sec (typical)
– Effective Byte Write Cycle
Time: 39 µs (typical)
• Fast Read Access Time
– 5.0V-only operation: 70 and 90 ns
– 3.0-3.6V operation: 150 and 200 ns
– 2.7-3.6V operation: 200 and 250 ns
• Latched Address and Data
• Automatic Write Timing
– Internal V
PP
Generation
• End of Write Detection
– Toggle Bit
– Data# Polling
• Hardware and Software Data Protection
• TTL I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pinouts and command sets
• Packages Available
– 32 Pin PDIP
– 32-Pin PLCC
– 32-Pin TSOP (8mm x 20mm)
The SST29EE512A/29LE512A/29VE512A are suited
for applications that require convenient and economical
updating of program, configuration, or data memory. For
all system applications, the SST29EE512A/29LE512A/
29VE512A significantly improve performance and reli-
ability, while lowering power consumption. The
SST29EE512A/29LE512A/29VE512A improve flexibil-
ity while lowering the cost for program, data, and configu-
ration storage applications.
To meet high density, surface mount requirements, the
SST29EE512A/29LE512A/29VE512A are offered in 32-
pin TSOP and 32-lead PLCC packages. A 600-mil, 32-
pin PDIP package is also available. See Figures 1 and 2
for pinouts.
Device Operation
The SST page mode EEPROM offers in-circuit electrical
write capability. The SST29EE512A/29LE512A/
29VE512A do not require separate Erase and Program
operations. The internally timed write cycle executes
both erase and program transparently to the user.
The SST29EE512A/29LE512A/29VE512A have indus-
try standard Software Data Protection. The
SST29EE512A/29LE512A/29VE512A are compatible
with industry standard EEPROM pinouts and
functionality.
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PRODUCT DESCRIPTION
The SST29EE512A/29LE512A/29VE512A are 64K x 8
CMOS, Page Write EEPROMs manufactured with
SST’s proprietary, high performance CMOS SuperFlash
technology. The split-gate cell design and thick oxide
tunneling injector attain better reliability and
manufacturability compared with alternate approaches.
The SST29EE512A/29LE512A/29VE512A write with a
single power supply. Internal Erase/Program is transpar-
ent to the user. The SST29EE512A/29LE512A/
29VE512A conform to JEDEC standard pinouts for byte-
wide memories.
Featuring high performance page write, the
SST29EE512A/29LE512A/29VE512A provide a typical
byte-write time of 39 µsec. The entire memory, i.e., 64
KBytes, can be written page-by-page in as little as 2.5
seconds, when using interface features such as Toggle
Bit or Data# Polling to indicate the completion of a write
cycle. To protect against inadvertent write, the
SST29EE512A/29LE512A/29VE512A have on-chip
hardware and software data protection schemes. De-
signed, manufactured, and tested for a wide spectrum of
applications, the SST29EE512A/29LE512A/29VE512A
are offered with a guaranteed page write endurance of
10
4
cycles. Data retention is rated at greater than 100
years.
© 1999 Silicon Storage Technology, Inc. The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc. These specifications are subject to change without notice.
302-01 2/99
1

SST29VE512A-250-4C-NH Related Products

SST29VE512A-250-4C-NH SST29LE512A-150-4C-NH SST29VE512A-250-4C-U2 SST29VE512A-200-4C-NH
Description EEPROM, 64KX8, 250ns, Parallel, CMOS, PQCC32 EEPROM, 64KX8, 150ns, Parallel, CMOS, PQCC32 EEPROM EEPROM, 64KX8, 200ns, Parallel, CMOS, PQCC32
package instruction QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6 , QCCJ, LDCC32,.5X.6
Reach Compliance Code unknown unknown unknown unknown
Is it Rohs certified? incompatible incompatible - incompatible
Maker Silicon Laboratories Inc - Silicon Laboratories Inc Silicon Laboratories Inc
Maximum access time 250 ns 150 ns - 200 ns
command user interface NO NO - NO
Data polling YES YES - YES
Durability 10000 Write/Erase Cycles 10000 Write/Erase Cycles - 10000 Write/Erase Cycles
JESD-30 code R-PQCC-J32 R-PQCC-J32 - R-PQCC-J32
JESD-609 code e0 e0 - e0
memory density 524288 bit 524288 bit - 524288 bit
Memory IC Type EEPROM EEPROM - EEPROM
memory width 8 8 - 8
Number of terminals 32 32 - 32
word count 65536 words 65536 words - 65536 words
character code 64000 64000 - 64000
Maximum operating temperature 70 °C 70 °C - 70 °C
organize 64KX8 64KX8 - 64KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code QCCJ QCCJ - QCCJ
Encapsulate equivalent code LDCC32,.5X.6 LDCC32,.5X.6 - LDCC32,.5X.6
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER - CHIP CARRIER
page size 128 words 128 words - 128 words
Parallel/Serial PARALLEL PARALLEL - PARALLEL
power supply 3/3.3 V 3.3 V - 3/3.3 V
Certification status Not Qualified Not Qualified - Not Qualified
Maximum standby current 0.000015 A 0.000015 A - 0.000015 A
Maximum slew rate 0.015 mA 0.015 mA - 0.015 mA
surface mount YES YES - YES
technology CMOS CMOS - CMOS
Temperature level COMMERCIAL COMMERCIAL - COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Terminal form J BEND J BEND - J BEND
Terminal pitch 1.27 mm 1.27 mm - 1.27 mm
Terminal location QUAD QUAD - QUAD
switch bit YES YES - YES
Maximum write cycle time (tWC) 10 ms 10 ms - 10 ms

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