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HYMR13216H-840

Description
Rambus DRAM Module, 32MX16, CMOS, RIMM-184
Categorystorage    storage   
File Size205KB,17 Pages
ManufacturerSK Hynix
Websitehttp://www.hynix.com/eng/
Download Datasheet Parametric View All

HYMR13216H-840 Overview

Rambus DRAM Module, 32MX16, CMOS, RIMM-184

HYMR13216H-840 Parametric

Parameter NameAttribute value
MakerSK Hynix
Parts packaging codeDMA
package instruction,
Contacts184
Reach Compliance Codeunknown
ECCN codeEAR99
access modeBLOCK ORIENTED PROTOCOL
Other featuresSELF CONTAINED REFRESH
JESD-30 codeR-XDMA-N184
memory density536870912 bit
Memory IC TypeRAMBUS DRAM MODULE
memory width16
Number of functions1
Number of ports1
Number of terminals184
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
organize32MX16
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)2.63 V
Minimum supply voltage (Vsup)2.37 V
Nominal supply voltage (Vsup)2.5 V
surface mountNO
technologyCMOS
Terminal formNO LEAD
Terminal locationDUAL
Direct Rambus RIMM
with 128/144Mbit RDRAMs
Preliminary
Overview
The Rambus
®
RIMM
TM
module is a general purpose high-
performance memory subsystem suitable for use in a broad
range of applications including computer memory, personal
computers, workstations, and other applications where high
bandwidth and low latency are required.
The Rambus RIMM module consist of 128Mb/144Mb
Direct Rambus DRAM devices. These are extremely high-
speed CMOS DRAMs organized as 8M words by 16 or 18
bits. The use of Rambus Signaling Level (RSL) technology
permits 600MHz ,711MHz or 800MHz transfer rates while
using conventional system and board design technologies.
Direct RDRAM devices are capable of sustained data
transfers at 1.25 ns per two bytes (10ns per 16 bytes).
The RDRAM architecture enables the highest sustained
bandwidth for multiple, simultaneous randomly addressed
memory transactions. The separate control and data buses
with independent row and column control yield over 95%
bus efficiency. The Direct RDRAM's 16-banks architecture
supports up to four simultaneous transactions per device.
Key Timing Parameters/Part Numbers
The following table lists the frequency and latency bins
available from RIMM modules. An optional -LP designator
is used to indicate low power modules.
Table 1: RIMM Module Frequency and Latency
Organization
x16
x16
x16
x16
x18
x18
x18
x18
I/O Freq.
MHz
600
711
800
800
600
711
800
800
t rac (Row Access
Time) ns
53
45
45
40
53
45
45
40
Features
w
High speed 800,711 and 600 MHz RDRAM storage
w
184 edge connector pads with 1 mm pad spacing
w
Maximum module PCB size: 133.5mm x 31.75mm x
1.37mm(5.21” x 1.25” x 0.05”)
w
Each RDRAM has 32 banks, for a total of 512, 384, 256,
192 or 128 banks on each 256MB, 192MB, 128MB,
96MB, or 64MB module respectively
w
Gold plated edge connector pad contacts
wSerial
Presence Detect(SPD) support
¾
w
Operates from a 2.5 volt supply (
¡
5%)
w
Low power and powerdown self refresh modes
w
Separate Row and Column buses for higher
efficiency
Form Factor
The Rambus RIMM modules are offered in a 184-pad 1mm
edge connector pad pitch from factor suitable for either 184
or 168 contact RIMM connectors. The RIMM module is
suitable for desktop and other system applications. Figure 1
shows an eight device Rambus RIMM module without heat
spreader.
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 1.0/Dec.99
1

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