CXK581001P-85LL datasheet, PDF

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CXK581001P-85LL: DescriptionStandard SRAM, 128KX8, 85ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32; Categorystorage storage; File Size231KB，10 Pages; ManufacturerSONY; Websitehttp://www.sony.co.jp

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CXK581001P-85LL Overview

Standard SRAM, 128KX8, 85ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

CXK581001P-85LL Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SONY
Parts packaging code	DIP
package instruction	DIP, DIP32,.6
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	85 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T32
JESD-609 code	e0
length	40.2 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5 mm
Minimum standby current	2 V
Maximum slew rate	0.08 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

CXK581001P-85LL Related Products

	CXK581001P-85LL	CXK581001P-85L	CXK581001M-70LTL	CXK581001M-70L	CXK581001M-70LL	CXK581001M-85L	CXK581001M-85LL	CXK581001P-70L	CXK581001P-70LL
Description	Standard SRAM, 128KX8, 85ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	Standard SRAM, 128KX8, 85ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32	Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32	Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32	Standard SRAM, 128KX8, 85ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32	Standard SRAM, 128KX8, 85ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32	Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Is it lead-free?	Contains lead	Contains lead	Lead free	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	conform to	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SONY	SONY	SONY	SONY	SONY	SONY	SONY	SONY	SONY
Parts packaging code	DIP	DIP	SOIC	SOIC	SOIC	SOIC	SOIC	DIP	DIP
package instruction	DIP, DIP32,.6	DIP, DIP32,.6	SOP,	SOP, SOP32,.56	SOP, SOP32,.56	SOP, SOP32,.56	SOP, SOP32,.56	DIP, DIP32,.6	DIP, DIP32,.6
Contacts	32	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	85 ns	85 ns	70 ns	70 ns	70 ns	85 ns	85 ns	70 ns	70 ns
JESD-30 code	R-PDIP-T32	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32	R-PDIP-T32
JESD-609 code	e0	e0	e6/e4	e0	e0	e0	e0	e0	e0
length	40.2 mm	40.2 mm	20.5 mm	20.5 mm	20.5 mm	20.5 mm	20.5 mm	40.2 mm	40.2 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	SOP	SOP	SOP	SOP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5 mm	5 mm	3.05 mm	3.05 mm	3.05 mm	3.05 mm	3.05 mm	5 mm	5 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	YES	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	TIN BISMUTH/PALLADIUM	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	10	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	11.2 mm	11.2 mm	11.2 mm	11.2 mm	11.2 mm	15.24 mm	15.24 mm
I/O type	COMMON	COMMON	-	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
Number of ports	1	1	-	1	1	1	1	1	1
Output characteristics	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	-	YES	YES	YES	YES	YES	YES
Encapsulate equivalent code	DIP32,.6	DIP32,.6	-	SOP32,.56	SOP32,.56	SOP32,.56	SOP32,.56	DIP32,.6	DIP32,.6
power supply	5 V	5 V	-	5 V	5 V	5 V	5 V	5 V	5 V
Minimum standby current	2 V	2 V	-	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	0.08 mA	0.08 mA	-	0.08 mA	0.08 mA	0.08 mA	0.08 mA	0.08 mA	0.08 mA

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