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CXK581001P-85L

Description
Standard SRAM, 128KX8, 85ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Categorystorage    storage   
File Size231KB,10 Pages
ManufacturerSONY
Websitehttp://www.sony.co.jp
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CXK581001P-85L Overview

Standard SRAM, 128KX8, 85ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

CXK581001P-85L Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSONY
Parts packaging codeDIP
package instructionDIP, DIP32,.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time85 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T32
JESD-609 codee0
length40.2 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP32,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5 mm
Minimum standby current2 V
Maximum slew rate0.08 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm

CXK581001P-85L Related Products

CXK581001P-85L CXK581001P-85LL CXK581001M-70LTL CXK581001M-70L CXK581001M-70LL CXK581001M-85L CXK581001M-85LL CXK581001P-70L CXK581001P-70LL
Description Standard SRAM, 128KX8, 85ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Standard SRAM, 128KX8, 85ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Standard SRAM, 128KX8, 85ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Standard SRAM, 128KX8, 85ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32 Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Is it lead-free? Contains lead Contains lead Lead free Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible conform to incompatible incompatible incompatible incompatible incompatible incompatible
Maker SONY SONY SONY SONY SONY SONY SONY SONY SONY
Parts packaging code DIP DIP SOIC SOIC SOIC SOIC SOIC DIP DIP
package instruction DIP, DIP32,.6 DIP, DIP32,.6 SOP, SOP, SOP32,.56 SOP, SOP32,.56 SOP, SOP32,.56 SOP, SOP32,.56 DIP, DIP32,.6 DIP, DIP32,.6
Contacts 32 32 32 32 32 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 85 ns 85 ns 70 ns 70 ns 70 ns 85 ns 85 ns 70 ns 70 ns
JESD-30 code R-PDIP-T32 R-PDIP-T32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDSO-G32 R-PDIP-T32 R-PDIP-T32
JESD-609 code e0 e0 e6/e4 e0 e0 e0 e0 e0 e0
length 40.2 mm 40.2 mm 20.5 mm 20.5 mm 20.5 mm 20.5 mm 20.5 mm 40.2 mm 40.2 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 32 32 32 32 32 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000 128000 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP SOP SOP SOP SOP SOP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5 mm 5 mm 3.05 mm 3.05 mm 3.05 mm 3.05 mm 3.05 mm 5 mm 5 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES YES YES YES YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN BISMUTH/PALLADIUM Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED 10 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 15.24 mm 15.24 mm 11.2 mm 11.2 mm 11.2 mm 11.2 mm 11.2 mm 15.24 mm 15.24 mm
I/O type COMMON COMMON - COMMON COMMON COMMON COMMON COMMON COMMON
Number of ports 1 1 - 1 1 1 1 1 1
Output characteristics 3-STATE 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES - YES YES YES YES YES YES
Encapsulate equivalent code DIP32,.6 DIP32,.6 - SOP32,.56 SOP32,.56 SOP32,.56 SOP32,.56 DIP32,.6 DIP32,.6
power supply 5 V 5 V - 5 V 5 V 5 V 5 V 5 V 5 V
Minimum standby current 2 V 2 V - 2 V 2 V 2 V 2 V 2 V 2 V
Maximum slew rate 0.08 mA 0.08 mA - 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA 0.08 mA

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