EEPROM, 512X8, Serial, CMOS, PDIP8,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP8,.3 |
| Reach Compliance Code | unknown |
| Data retention time - minimum | 40 |
| Durability | 10000 Write/Erase Cycles |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| memory density | 4096 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of terminals | 8 |
| word count | 512 words |
| character code | 512 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -25 °C |
| organize | 512X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | SERIAL |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| Serial bus type | I2C |
| Maximum standby current | 0.0000035 A |
| Maximum slew rate | 0.0008 mA |
| surface mount | NO |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| write protect | HARDWARE |
| PCD8594D-2P | PCA8594F-2T | PCA8594F-2P | |
|---|---|---|---|
| Description | EEPROM, 512X8, Serial, CMOS, PDIP8, | EEPROM, 512X8, Serial, CMOS, PDSO8, | EEPROM, 512X8, Serial, CMOS, PDIP8, |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP8,.3 | SOP, SOP8,.4 | DIP, DIP8,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| Data retention time - minimum | 40 | 40 | 40 |
| Durability | 10000 Write/Erase Cycles | 50000 Write/Erase Cycles | 50000 Write/Erase Cycles |
| JESD-30 code | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 |
| JESD-609 code | e0 | e0 | e0 |
| memory density | 4096 bit | 4096 bit | 4096 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 |
| Number of terminals | 8 | 8 | 8 |
| word count | 512 words | 512 words | 512 words |
| character code | 512 | 512 | 512 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C |
| Minimum operating temperature | -25 °C | -40 °C | -40 °C |
| organize | 512X8 | 512X8 | 512X8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | DIP |
| Encapsulate equivalent code | DIP8,.3 | SOP8,.4 | DIP8,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | IN-LINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL |
| power supply | 3.3/5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Serial bus type | I2C | I2C | I2C |
| Maximum standby current | 0.0000035 A | 0.00001 A | 0.00001 A |
| Maximum slew rate | 0.0008 mA | 0.0025 mA | 0.0025 mA |
| surface mount | NO | YES | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | OTHER | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| write protect | HARDWARE | HARDWARE | HARDWARE |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V |
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