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PCA8594F-2P

Description
EEPROM, 512X8, Serial, CMOS, PDIP8,
Categorystorage    storage   
File Size135KB,20 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
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PCA8594F-2P Overview

EEPROM, 512X8, Serial, CMOS, PDIP8,

PCA8594F-2P Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionDIP, DIP8,.3
Reach Compliance Codeunknown
Data retention time - minimum40
Durability50000 Write/Erase Cycles
JESD-30 codeR-PDIP-T8
JESD-609 codee0
memory density4096 bit
Memory IC TypeEEPROM
memory width8
Number of terminals8
word count512 words
character code512
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize512X8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialSERIAL
power supply5 V
Certification statusNot Qualified
Serial bus typeI2C
Maximum standby current0.00001 A
Maximum slew rate0.0025 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
write protectHARDWARE

PCA8594F-2P Related Products

PCA8594F-2P PCA8594F-2T PCD8594D-2P
Description EEPROM, 512X8, Serial, CMOS, PDIP8, EEPROM, 512X8, Serial, CMOS, PDSO8, EEPROM, 512X8, Serial, CMOS, PDIP8,
Is it Rohs certified? incompatible incompatible incompatible
package instruction DIP, DIP8,.3 SOP, SOP8,.4 DIP, DIP8,.3
Reach Compliance Code unknown unknown unknown
Data retention time - minimum 40 40 40
Durability 50000 Write/Erase Cycles 50000 Write/Erase Cycles 10000 Write/Erase Cycles
JESD-30 code R-PDIP-T8 R-PDSO-G8 R-PDIP-T8
JESD-609 code e0 e0 e0
memory density 4096 bit 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM EEPROM
memory width 8 8 8
Number of terminals 8 8 8
word count 512 words 512 words 512 words
character code 512 512 512
Maximum operating temperature 125 °C 125 °C 70 °C
Minimum operating temperature -40 °C -40 °C -25 °C
organize 512X8 512X8 512X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP DIP
Encapsulate equivalent code DIP8,.3 SOP8,.4 DIP8,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE
Parallel/Serial SERIAL SERIAL SERIAL
power supply 5 V 5 V 3.3/5 V
Certification status Not Qualified Not Qualified Not Qualified
Serial bus type I2C I2C I2C
Maximum standby current 0.00001 A 0.00001 A 0.0000035 A
Maximum slew rate 0.0025 mA 0.0025 mA 0.0008 mA
surface mount NO YES NO
technology CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL
write protect HARDWARE HARDWARE HARDWARE
Maker Philips Semiconductors (NXP Semiconductors N.V.) - Philips Semiconductors (NXP Semiconductors N.V.)
Nominal supply voltage (Vsup) 5 V 5 V -
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