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DPS512X32CV3-30M

Description
SRAM Module, 2MX8, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Categorystorage    storage   
File Size165KB,8 Pages
ManufacturerTwilight Technology Inc.
Download Datasheet Parametric View All

DPS512X32CV3-30M Overview

SRAM Module, 2MX8, 30ns, CMOS, CPGA66, 1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

DPS512X32CV3-30M Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTwilight Technology Inc.
Parts packaging codePGA
package instruction1.090 X 1.090 INCH, 0.776 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Contacts66
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time30 ns
Other featuresUSER CONFIGURABLE AS 512K X 32, 1M X 16
JESD-30 codeS-CPGA-P66
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width8
Number of functions1
Number of terminals66
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2MX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height19.7104 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED

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