16-BIT, OTPROM, 16MHz, MICROCONTROLLER, PQCC84, PLASTIC, LCC-84
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | STMicroelectronics |
Parts packaging code | LCC |
package instruction | PLASTIC, LCC-84 |
Contacts | 84 |
Reach Compliance Code | not_compliant |
Has ADC | YES |
Address bus width | 16 |
bit size | 16 |
CPU series | ST9 |
maximum clock frequency | 16 MHz |
DAC channel | NO |
DMA channel | YES |
External data bus width | 8 |
JESD-30 code | S-PQCC-J84 |
JESD-609 code | e0 |
length | 29.3116 mm |
Number of I/O lines | 72 |
Number of terminals | 84 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC84,1.2SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3/5 V |
Certification status | Not Qualified |
RAM (bytes) | 2048 |
rom(word) | 65536 |
ROM programmability | OTPROM |
Maximum seat height | 5.08 mm |
speed | 16 MHz |
Maximum slew rate | 40 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | HCMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 29.3116 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
ST90T158P9C6 | ST90158P9C6 | |
---|---|---|
Description | 16-BIT, OTPROM, 16MHz, MICROCONTROLLER, PQCC84, PLASTIC, LCC-84 | 16-BIT, MROM, 16MHz, MICROCONTROLLER, PQCC84, PLASTIC, LCC-84 |
Is it Rohs certified? | incompatible | incompatible |
Parts packaging code | LCC | LCC |
package instruction | PLASTIC, LCC-84 | PLASTIC, LCC-84 |
Contacts | 84 | 84 |
Reach Compliance Code | not_compliant | not_compliant |
Has ADC | YES | YES |
Address bus width | 16 | 16 |
bit size | 16 | 16 |
CPU series | ST9 | ST9 |
maximum clock frequency | 16 MHz | 16 MHz |
DAC channel | NO | NO |
DMA channel | YES | YES |
External data bus width | 8 | 8 |
JESD-30 code | S-PQCC-J84 | S-PQCC-J84 |
JESD-609 code | e0 | e0 |
length | 29.3116 mm | 29.3116 mm |
Number of I/O lines | 72 | 72 |
Number of terminals | 84 | 84 |
Maximum operating temperature | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C |
PWM channel | YES | YES |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | QCCJ |
Encapsulate equivalent code | LDCC84,1.2SQ | LDCC84,1.2SQ |
Package shape | SQUARE | SQUARE |
Package form | CHIP CARRIER | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
power supply | 3/5 V | 3/5 V |
Certification status | Not Qualified | Not Qualified |
RAM (bytes) | 2048 | 2048 |
rom(word) | 65536 | 65536 |
ROM programmability | OTPROM | MROM |
Maximum seat height | 5.08 mm | 5.08 mm |
speed | 16 MHz | 16 MHz |
Maximum slew rate | 40 mA | 40 mA |
Maximum supply voltage | 5.5 V | 5.5 V |
Minimum supply voltage | 4.5 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V |
surface mount | YES | YES |
technology | HCMOS | HCMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | J BEND |
Terminal pitch | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
width | 29.3116 mm | 29.3116 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER |