MPC8547ECHXAUJA datasheet, PDF

MPC8547ECHXAUJA: Description32-BIT, 1000MHz, MICROPROCESSOR, CBGA783, 29 X 29 MM, 1 MM PITCH, FLIP CHIP, CERAMIC, BGA-783; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，142 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MPC8547ECHXAUJA Overview

32-BIT, 1000MHz, MICROPROCESSOR, CBGA783, 29 X 29 MM, 1 MM PITCH, FLIP CHIP, CERAMIC, BGA-783

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	BGA
package instruction	BGA,
Contacts	783
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Address bus width	64
bit size	32
boundary scan	YES
maximum clock frequency	133 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-CBGA-B783
JESD-609 code	e0
length	29 mm
low power mode	YES
Number of terminals	783
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	3.38 mm
speed	1000 MHz
Maximum supply voltage	1.155 V
Minimum supply voltage	1.045 V
Nominal supply voltage	1.1 V
surface mount	YES
technology	CMOS
Terminal surface	TIN LEAD SILVER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	29 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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