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NM24C02ULEM8

Description
256X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, SOIC-8
Categorystorage    storage   
File Size781KB,14 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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NM24C02ULEM8 Overview

256X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, SOIC-8

NM24C02ULEM8 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeSOIC
package instructionSOP,
Contacts8
Reach Compliance Codeunknown
Other featuresDATA RETENTION > 40 YEARS
Maximum clock frequency (fCLK)0.1 MHz
JESD-30 codeR-PDSO-G8
JESD-609 codee0
length4.9 mm
memory density2048 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count256 words
character code256
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256X8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusCOMMERCIAL
Maximum seat height1.75 mm
Serial bus typeI2C
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
Maximum write cycle time (tWC)15 ms
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NM24C02ULEM8 Related Products

NM24C02ULEM8 NM24C02ULEM8X NM24C02UFLMT8 NM24C02UN NM24C02UEN NM24C02ULM8X
Description 256X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, SOIC-8 256X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, SOIC-8 256X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, TSSOP-8 256X8 I2C/2-WIRE SERIAL EEPROM, PDIP8, PLASTIC, DIP-8 256X8 I2C/2-WIRE SERIAL EEPROM, PDIP8, PLASTIC, DIP-8 256X8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, SOIC-8
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code SOIC SOIC SOIC DIP DIP SOIC
package instruction SOP, PLASTIC, SOIC-8 PLASTIC, TSSOP-8 DIP, PLASTIC, DIP-8 PLASTIC, SOIC-8
Contacts 8 8 8 8 8 8
Reach Compliance Code unknown unknown unknown unknown unknown unknow
Other features DATA RETENTION > 40 YEARS DATA RETENTION > 40 YEARS DATA RETENTION > 40 YEARS DATA RETENTION > 40 YEARS DATA RETENTION > 40 YEARS DATA RETENTION > 40 YEARS
Maximum clock frequency (fCLK) 0.1 MHz 0.1 MHz 0.4 MHz 0.1 MHz 0.1 MHz 0.1 MHz
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDIP-T8 R-PDSO-G8
JESD-609 code e0 e0 e0 e0 e0 e0
length 4.9 mm 4.9 mm 4.4 mm 9.817 mm 9.817 mm 4.9 mm
memory density 2048 bit 2048 bit 2048 bit 2048 bit 2048 bit 2048 bi
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8
word count 256 words 256 words 256 words 256 words 256 words 256 words
character code 256 256 256 256 256 256
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 70 °C 70 °C 85 °C 70 °C
organize 256X8 256X8 256X8 256X8 256X8 256X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP TSSOP DIP DIP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE IN-LINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.75 mm 1.75 mm 1.2 mm 5.08 mm 5.08 mm 1.75 mm
Serial bus type I2C I2C I2C I2C I2C I2C
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 4.5 V 4.5 V 2.7 V
surface mount YES YES YES NO NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 1.27 mm 0.65 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3.9 mm 3.9 mm 3 mm 7.62 mm 7.62 mm 3.9 mm
Maximum write cycle time (tWC) 15 ms 15 ms 15 ms 10 ms 10 ms 15 ms
Maker Rochester Electronics - - Rochester Electronics Rochester Electronics Rochester Electronics
Humidity sensitivity level - NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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