|
TPA0172PWPG4 |
TPA0172PWP |
TPA0172PWPRG4 |
TPA0172PWPR |
Description |
Stereo Class-AB Audio Amplifier with Stereo Headphone Drive and I2C Control 24-HTSSOP -40 to 85 |
Stereo Class-AB Audio Amplifier with Stereo Headphone Drive and I2C Control 24-HTSSOP -40 to 85 |
Stereo Class-AB Audio Amplifier with Stereo Headphone Drive and I2C Control 24-HTSSOP -40 to 85 |
Stereo Class-AB Audio Amplifier with Stereo Headphone Drive and I2C Control 24-HTSSOP -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
TSSOP |
TSSOP |
TSSOP |
TSSOP |
package instruction |
HTSSOP, TSSOP20,.25 |
HTSSOP, TSSOP20,.25 |
HTSSOP, TSSOP20,.25 |
HTSSOP, TSSOP20,.25 |
Contacts |
24 |
24 |
24 |
24 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Commercial integrated circuit types |
VOLUME CONTROL CIRCUIT |
VOLUME CONTROL CIRCUIT |
VOLUME CONTROL CIRCUIT |
VOLUME CONTROL CIRCUIT |
JESD-30 code |
R-PDSO-G24 |
R-PDSO-G24 |
R-PDSO-G24 |
R-PDSO-G24 |
JESD-609 code |
e4 |
e4 |
e4 |
e4 |
length |
7.8 mm |
7.8 mm |
7.8 mm |
7.8 mm |
Humidity sensitivity level |
2 |
2 |
2 |
2 |
Number of frequency bands |
1 |
1 |
1 |
1 |
Number of channels |
2 |
2 |
2 |
2 |
Number of functions |
1 |
1 |
1 |
1 |
Number of terminals |
24 |
24 |
24 |
24 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HTSSOP |
HTSSOP |
HTSSOP |
HTSSOP |
Encapsulate equivalent code |
TSSOP20,.25 |
TSSOP20,.25 |
TSSOP20,.25 |
TSSOP20,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
power supply |
3.3/5,5 V |
3.3/5,5 V |
3.3/5,5 V |
3.3/5,5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.2 mm |
1.2 mm |
1.2 mm |
1.2 mm |
Maximum slew rate |
12 mA |
12 mA |
12 mA |
12 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
0.65 mm |
0.65 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
4.4 mm |
4.4 mm |
4.4 mm |
4.4 mm |