Power Field-Effect Transistor, 9A I(D), 200V, 0.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AA,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Other features | AVALANCHE RATED |
Avalanche Energy Efficiency Rating (Eas) | 54 mJ |
Shell connection | DRAIN |
Configuration | SINGLE |
Minimum drain-source breakdown voltage | 200 V |
Maximum drain current (Abs) (ID) | 9 A |
Maximum drain current (ID) | 9 A |
Maximum drain-source on-resistance | 0.4 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code | TO-204AA |
JESD-30 code | O-MBFM-P2 |
JESD-609 code | e0 |
Number of components | 1 |
Number of terminals | 2 |
Operating mode | ENHANCEMENT MODE |
Maximum operating temperature | 150 °C |
Minimum operating temperature | -55 °C |
Package body material | METAL |
Package shape | ROUND |
Package form | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL |
Maximum power dissipation(Abs) | 75 W |
Maximum pulsed drain current (IDM) | 36 A |
Certification status | Not Qualified |
Guideline | MILITARY STANDARD (USA) |
surface mount | NO |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
Base Number Matches | 1 |
2N6758 | IRF230 | IRF230PBF | |
---|---|---|---|
Description | Power Field-Effect Transistor, 9A I(D), 200V, 0.4ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AA, | Power Field-Effect Transistor, 9A I(D), 200V, 0.49ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AA, HERMETIC SEALED, MODIFIED TO-3, 2 PIN | Power Field-Effect Transistor, 9A I(D), 200V, 0.49ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-204AA, HERMETIC SEALED, MODIFIED TO-3, 2 PIN |
Is it Rohs certified? | incompatible | incompatible | conform to |
Reach Compliance Code | compli | unknown | compliant |
Avalanche Energy Efficiency Rating (Eas) | 54 mJ | 54 mJ | 54 mJ |
Shell connection | DRAIN | DRAIN | DRAIN |
Configuration | SINGLE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage | 200 V | 200 V | 200 V |
Maximum drain current (ID) | 9 A | 9 A | 9 A |
Maximum drain-source on-resistance | 0.4 Ω | 0.49 Ω | 0.49 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95 code | TO-204AA | TO-204AA | TO-204AA |
JESD-30 code | O-MBFM-P2 | O-MBFM-P2 | O-MBFM-P2 |
Number of components | 1 | 1 | 1 |
Number of terminals | 2 | 2 | 2 |
Operating mode | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
Maximum operating temperature | 150 °C | 150 °C | 150 °C |
Package body material | METAL | METAL | METAL |
Package shape | ROUND | ROUND | ROUND |
Package form | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL | N-CHANNEL | N-CHANNEL |
Maximum pulsed drain current (IDM) | 36 A | 36 A | 36 A |
surface mount | NO | NO | NO |
Terminal form | PIN/PEG | PIN/PEG | PIN/PEG |
Terminal location | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
transistor applications | SWITCHING | SWITCHING | SWITCHING |
Transistor component materials | SILICON | SILICON | SILICON |
ECCN code | EAR99 | EAR99 | - |
Maximum drain current (Abs) (ID) | 9 A | 9 A | - |
JESD-609 code | e0 | e0 | - |
Maximum power dissipation(Abs) | 75 W | 75 W | - |
Certification status | Not Qualified | Not Qualified | - |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Maker | - | Infineon | Infineon |
package instruction | - | TO-3, 2 PIN | FLANGE MOUNT, O-MBFM-P2 |