|
AM29C331/BZC |
AM29C331-1GC |
AM29C331-1GCB |
AM29C331GC |
AM29C331GCB |
Description |
Microprogram Sequencer, 16-Bit, CMOS, CPGA120, CERAMIC, PGA-120 |
Microprogram Sequencer, 16-Bit, CMOS, CPGA120, CERAMIC, PGA-120 |
Microprogram Sequencer, 16-Bit, CMOS, CPGA120, CERAMIC, PGA-120 |
Microprogram Sequencer, 16-Bit, CMOS, CPGA120, CERAMIC, PGA-120 |
Microprogram Sequencer, 16-Bit, CMOS, CPGA120, CERAMIC, PGA-120 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
Parts packaging code |
PGA |
PGA |
PGA |
PGA |
PGA |
package instruction |
PGA, PGA120,13X13 |
CERAMIC, PGA-120 |
PGA, PGA120,13X13 |
CERAMIC, PGA-120 |
PGA, PGA120,13X13 |
Contacts |
120 |
120 |
120 |
120 |
120 |
Reach Compliance Code |
unknown |
unknow |
unknow |
unknow |
unknow |
External data bus width |
16 |
16 |
16 |
16 |
16 |
JESD-30 code |
S-CPGA-P120 |
S-CPGA-P120 |
S-CPGA-P120 |
S-CPGA-P120 |
S-CPGA-P120 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
length |
34.544 mm |
34.544 mm |
34.544 mm |
34.544 mm |
34.544 mm |
Number of terminals |
120 |
120 |
120 |
120 |
120 |
Maximum operating temperature |
125 °C |
70 °C |
70 °C |
70 °C |
70 °C |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
PGA |
PGA |
PGA |
PGA |
PGA |
Encapsulate equivalent code |
PGA120,13X13 |
PGA120,13X13 |
PGA120,13X13 |
PGA120,13X13 |
PGA120,13X13 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
GRID ARRAY |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
4.953 mm |
4.953 mm |
4.953 mm |
4.953 mm |
4.953 mm |
Maximum slew rate |
50 mA |
50 mA |
50 mA |
40 mA |
40 mA |
Maximum supply voltage |
5.5 V |
5.25 V |
5.25 V |
5.25 V |
5.25 V |
Minimum supply voltage |
4.5 V |
4.75 V |
4.75 V |
4.75 V |
4.75 V |
Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
NO |
NO |
NO |
NO |
NO |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
Terminal location |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
34.544 mm |
34.544 mm |
34.544 mm |
34.544 mm |
34.544 mm |
uPs/uCs/peripheral integrated circuit type |
BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
Maker |
AMD |
AMD |
- |
AMD |
- |
Base Number Matches |
- |
1 |
1 |
1 |
1 |