Microprocessor, 16-Bit, 10MHz, NMOS, PQCC68, PLASTIC, LCC-68
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Infineon |
Parts packaging code | LCC |
package instruction | PLASTIC, LCC-68 |
Contacts | 68 |
Reach Compliance Code | not_compliant |
Other features | PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS |
Address bus width | 20 |
bit size | 16 |
boundary scan | NO |
maximum clock frequency | 20 MHz |
External data bus width | 16 |
Format | FIXED POINT |
Integrated cache | NO |
JESD-30 code | S-PQCC-J68 |
JESD-609 code | e0 |
length | 24.3 mm |
low power mode | NO |
Number of terminals | 68 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC68,1.0SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.1 mm |
speed | 10 MHz |
Maximum slew rate | 550 mA |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | NMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 24.3 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR |
SAB80186-1-N | SAB80186-N | |
---|---|---|
Description | Microprocessor, 16-Bit, 10MHz, NMOS, PQCC68, PLASTIC, LCC-68 | Microprocessor, 16-Bit, 8MHz, NMOS, PQCC68, PLASTIC, LCC-68 |
Is it Rohs certified? | incompatible | incompatible |
Maker | Infineon | Infineon |
Parts packaging code | LCC | LCC |
package instruction | PLASTIC, LCC-68 | PLASTIC, LCC-68 |
Contacts | 68 | 68 |
Reach Compliance Code | not_compliant | not_compliant |
Other features | PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS | PROGRAMMABLE CHIP SELECT; 3 INTERNAL PROGRAMMABLE TIMERS |
Address bus width | 20 | 20 |
bit size | 16 | 16 |
boundary scan | NO | NO |
maximum clock frequency | 20 MHz | 16 MHz |
External data bus width | 16 | 16 |
Format | FIXED POINT | FIXED POINT |
Integrated cache | NO | NO |
JESD-30 code | S-PQCC-J68 | S-PQCC-J68 |
JESD-609 code | e0 | e0 |
length | 24.3 mm | 24.3 mm |
low power mode | NO | NO |
Number of terminals | 68 | 68 |
Maximum operating temperature | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | QCCJ |
Encapsulate equivalent code | LDCC68,1.0SQ | LDCC68,1.0SQ |
Package shape | SQUARE | SQUARE |
Package form | CHIP CARRIER | CHIP CARRIER |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 5.1 mm | 5.1 mm |
speed | 10 MHz | 8 MHz |
Maximum slew rate | 550 mA | 550 mA |
Maximum supply voltage | 5.5 V | 5.5 V |
Minimum supply voltage | 4.5 V | 4.5 V |
Nominal supply voltage | 5 V | 5 V |
surface mount | YES | YES |
technology | NMOS | NMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | J BEND |
Terminal pitch | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
width | 24.3 mm | 24.3 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR | MICROPROCESSOR |