DAC38J84IAAVR datasheet, PDF - EEWORLD Datasheet

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DAC38J84IAAVR: DescriptionQuad-Channel, 16-Bit, 2.5-GSPS, 1x-16x Interpolating Digital-to-Analog Converter (DAC) 144-FCBGA -40 to 85; CategoryAnalog mixed-signal IC converter; File Size3MB，119 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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DAC38J84IAAVR Overview

Quad-Channel, 16-Bit, 2.5-GSPS, 1x-16x Interpolating Digital-to-Analog Converter (DAC) 144-FCBGA -40 to 85

DAC38J84IAAVR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	HBGA,
Contacts	144
Reach Compliance Code	compliant
Factory Lead Time	6 weeks
Maximum analog output voltage	0.6 V
Minimum analog output voltage	-0.5 V
Converter type	D/A CONVERTER
Enter bit code	OFFSET BINARY, 2\'S COMPLEMENT BINARY
Input format	PARALLEL, WORD
JESD-30 code	S-PBGA-B144
JESD-609 code	e1
length	10 mm
Humidity sensitivity level	3
Number of digits	16
Number of functions	1
Number of terminals	144
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HBGA
Package shape	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	260
Sampling rate	2500 MHz
Maximum seat height	1.94 mm
Nominal settling time (tstl)	0.01 µs
Nominal supply voltage	0.9 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm

DAC38J84IAAVR Related Products

	DAC38J84IAAVR	DAC38J84IAAV	DAC37J84IAAV	DAC37J84IAAVR
Description	Quad-Channel, 16-Bit, 2.5-GSPS, 1x-16x Interpolating Digital-to-Analog Converter (DAC) 144-FCBGA -40 to 85	Quad-Channel, 16-Bit, 2.5-GSPS, 1x-16x Interpolating Digital-to-Analog Converter (DAC) 144-FCBGA -40 to 85	Quad-Channel, 16-Bit, 1.6-GSPS, 1x-16x Interpolating Digital-to-Analog Converter (DAC) 144-FCBGA -40 to 85	Quad-Channel, 16-Bit, 1.6-GSPS, 1x-16x Interpolating Digital-to-Analog Converter (DAC) 144-FCBGA -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA	BGA	BGA
package instruction	HBGA,	HBGA,	HBGA,	HBGA,
Contacts	144	144	144	144
Reach Compliance Code	compliant	compli	compli	compliant
Factory Lead Time	6 weeks	6 weeks	6 weeks	6 weeks
Maximum analog output voltage	0.6 V	0.6 V	0.6 V	0.6 V
Minimum analog output voltage	-0.5 V	-0.5 V	-0.5 V	-0.5 V
Converter type	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER
Enter bit code	OFFSET BINARY, 2\'S COMPLEMENT BINARY	OFFSET BINARY, 2\'S COMPLEMENT BINARY	OFFSET BINARY, 2\'S COMPLEMENT BINARY	OFFSET BINARY, 2\'S COMPLEMENT BINARY
Input format	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD	PARALLEL, WORD
JESD-30 code	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144	S-PBGA-B144
JESD-609 code	e1	e1	e1	e1
length	10 mm	10 mm	10 mm	10 mm
Humidity sensitivity level	3	3	3	3
Number of digits	16	16	16	16
Number of functions	1	1	1	1
Number of terminals	144	144	144	144
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HBGA	HBGA	HBGA	HBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	260	260	260	260
Sampling rate	2500 MHz	2500 MHz	1600 MHz	1600 MHz
Maximum seat height	1.94 mm	1.94 mm	1.94 mm	1.94 mm
Nominal settling time (tstl)	0.01 µs	0.01 µs	0.01 µs	0.01 µs
Nominal supply voltage	0.9 V	0.9 V	0.9 V	0.9 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10 mm	10 mm	10 mm	10 mm

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