SRAM Module, 1MX8, 35ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Twilight Technology Inc. |
Parts packaging code | PGA |
package instruction | APGA, PGA50,5X10 |
Contacts | 50 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.A |
Maximum access time | 35 ns |
Other features | USER CONFIGURABLE AS 512K X 16 |
I/O type | COMMON |
JESD-30 code | R-CPGA-P50 |
length | 25.146 mm |
memory density | 8388608 bit |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 50 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 1MX8 |
Output characteristics | 3-STATE |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | APGA |
Encapsulate equivalent code | PGA50,5X10 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, PIGGYBACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 21.0312 mm |
Maximum standby current | 0.0032 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.4 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 13.716 mm |