CC2640F128RSMT datasheet, PDF - EEWORLD Datasheet

CC2640F128RSMT: DescriptionSimpleLink ultra-low power wireless MCU for Bluetooth low energy 32-VQFN -40 to 85; CategoryWireless rf/communication Telecom circuit; File Size2MB，57 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

Stay tuned Parametric Compare

CC2640F128RSMT Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	CC2640F128RSMT	-	-	View	Buy Now

SimpleLink ultra-low power wireless MCU for Bluetooth low energy 32-VQFN -40 to 85

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
package instruction	HVQCCN,
Reach Compliance Code	compli
Factory Lead Time	6 weeks
JESD-30 code	S-PQCC-N32
JESD-609 code	e4
length	4 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	32
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Maximum seat height	1 mm
Nominal supply voltage	3 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.4 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	4 mm
Base Number Matches	1

	CC2640F128RSMT	CC2640F128RGZT
Description	SimpleLink ultra-low power wireless MCU for Bluetooth low energy 32-VQFN -40 to 85	SimpleLink ultra-low power wireless MCU for Bluetooth low energy 48-VQFN -40 to 85
Brand Name	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free
Is it Rohs certified?	conform to	conform to
package instruction	HVQCCN,	HVQCCN,
Reach Compliance Code	compli	compli
Factory Lead Time	6 weeks	6 weeks
JESD-30 code	S-PQCC-N32	S-PQCC-N48
JESD-609 code	e4	e4
length	4 mm	7 mm
Humidity sensitivity level	3	3
Number of functions	1	1
Number of terminals	32	48
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVQCCN	HVQCCN
Package shape	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260
Maximum seat height	1 mm	1 mm
Nominal supply voltage	3 V	3 V
surface mount	YES	YES
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD	NO LEAD
Terminal pitch	0.4 mm	0.5 mm
Terminal location	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	4 mm	7 mm
Base Number Matches	1	1

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components