LM3S1165-IBZ50-A2 datasheet, PDF

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LM3S1165-IBZ50-A2: DescriptionStellaris LM3S Microcontroller 108-NFBGA -40 to 85; CategoryThe embedded processor and controller Microcontrollers and processors; File Size5MB，679 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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Stellaris LM3S Microcontroller 108-NFBGA -40 to 85

LM3S1165-IBZ50-A2 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	LFBGA, BGA108,12X12,32
Contacts	108
Reach Compliance Code	compli
Factory Lead Time	26 weeks
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	0.032 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	S-PBGA-B108
JESD-609 code	e1
length	10 mm
Humidity sensitivity level	3
Number of I/O lines	43
Number of terminals	108
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA108,12X12,32
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
power supply	2.5,3.3 V
Certification status	Not Qualified
RAM (bytes)	16384
rom(word)	65536
ROM programmability	FLASH
Maximum seat height	1.5 mm
speed	50 MHz
Maximum supply voltage	2.75 V
Minimum supply voltage	2.25 V
Nominal supply voltage	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

LM3S1165-IBZ50-A2 Related Products

	LM3S1165-IBZ50-A2	LM3S1165-IBZ50-A2T	LM3S1165-IQC50-A2	LM3S1165-IQC50-A2T
Description	Stellaris LM3S Microcontroller 108-NFBGA -40 to 85	Stellaris LM3S Microcontroller 108-NFBGA -40 to 85	Stellaris LM3S Microcontroller 100-LQFP -40 to 85	Stellaris LM3S Microcontroller 100-LQFP -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	BGA	BGA	QFP	QFP
package instruction	LFBGA, BGA108,12X12,32	LFBGA, BGA108,12X12,32	LFQFP, QFP100,.63SQ,20	LFQFP, QFP100,.63SQ,20
Contacts	108	108	100	100
Reach Compliance Code	compli	compli	compli	compli
Has ADC	YES	YES	YES	YES
bit size	32	32	32	32
maximum clock frequency	0.032 MHz	0.032 MHz	0.032 MHz	0.032 MHz
DAC channel	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO
JESD-30 code	S-PBGA-B108	S-PBGA-B108	S-PQFP-G100	S-PQFP-G100
JESD-609 code	e1	e1	e3	e3
length	10 mm	10 mm	14 mm	14 mm
Humidity sensitivity level	3	3	3	3
Number of I/O lines	43	43	43	43
Number of terminals	108	108	100	100
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFQFP	LFQFP
Encapsulate equivalent code	BGA108,12X12,32	BGA108,12X12,32	QFP100,.63SQ,20	QFP100,.63SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260
power supply	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	16384	16384	16384	16384
rom(word)	65536	65536	65536	65536
ROM programmability	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.5 mm	1.5 mm	1.6 mm	1.6 mm
speed	50 MHz	50 MHz	50 MHz	50 MHz
Maximum supply voltage	2.75 V	2.75 V	2.75 V	2.75 V
Minimum supply voltage	2.25 V	2.25 V	2.25 V	2.25 V
Nominal supply voltage	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	BALL	BALL	GULL WING	GULL WING
Terminal pitch	0.8 mm	0.8 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10 mm	10 mm	14 mm	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Factory Lead Time	26 weeks	-	1 week	16 weeks

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