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MXLSMCJ11ATR

Description
1500W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB, PLASTIC PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size187KB,4 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

MXLSMCJ11ATR Overview

1500W, UNIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB, PLASTIC PACKAGE-2

MXLSMCJ11ATR Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDO-214AB
package instructionR-PDSO-J2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresHIGH RELIABILITY
Maximum breakdown voltage13.5 V
Minimum breakdown voltage12.2 V
Breakdown voltage nominal value12.85 V
Maximum clamping voltage18.2 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-214AB
JESD-30 codeR-PDSO-J2
JESD-609 codee0
Humidity sensitivity level1
Maximum non-repetitive peak reverse power dissipation1500 W
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation1.56 W
Certification statusNot Qualified
GuidelineMIL-19500
Maximum repetitive peak reverse voltage11 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formJ BEND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
Website: http://www.microsemi.com
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
SURFACE MOUNT 1500 Watt
Transient Voltage Suppressor
- High Reliability controlled devices
- Unidirectional (A) and Bidirectional (CA) construction
- Available in both J-bend and Gull-wing terminations
- Selections for 5.0 to 170 V standoff voltages (V
WM
)
LEVELS
M, MA, MX, MXL
DEVICES
MSMCJ5.0A thru MSMCJ170CA, e3
and MSMCG5.0A thru MSMCG170CA, e3
FEATURES
High reliability controlled devices with fabrication and assembly lot traceability
100 % surge tested devices
Optional upscreening available by replacing the M prefix with MA, MX or MXL prefixes.
These prefixes specify various screening and conformance inspection options based on
MIL-PRF-19500. Refer to
MicroNote 129
for more details on the screening options.
Axial-lead equivalent packages for thru-hole mounting available as 1.5KE6.8A to
1.5KE200CA or 1N6267 thru 1N6303A and 1N5908 (consult factory for other surface mount
options).
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding an “e3” suffix
3σ lot norm screening performed on Standby Current I
D
Refer to table below
for dimensions
APPLICATIONS / BENEFITS
Protection from switching transients and induced RF
Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4
Secondary lightening protection per IEC 61000-4-5 with 42 Ohms source impedance:
o
Class 1: MSMC5.0A to MSMC170CA
o
Class 2: MSMC5.0A to MSMC150CA
o
Class 3: MSMC5.0A to MSMC75CA
o
Class 4: MSMC5.0A to MSMC36CA
Secondary lightening protection per IEC 61000-4-5 with 12 Ohms source impedance:
o
Class 1: MSMC5.0A to MSMC90CA
o
Class 2: MSMC5.0A to MSMC45CA
o
Class 3: MSMC5.0A to MSMC24CA
o
Class 4: MSMC5.0A to MSMC11CA
Secondary lightening protection per IEC 61000-4-5 with 2 Ohms source impedance:
o
Class 2: MSMC5.0A to MSMC22CA
o
Class 3: MSMC5.0A to MSMC10CA
MAXIMUM RATINGS
Peak Pulse Power dissipation at 25 ºC: 1500 watts at 10/1000
μs
(also see Figures 1,2, and
3) with impulse repetition rate (duty factor) of 0.01 % or less
t
clamping
(0 volts to V
BR
min.): < 100 ps theoretical for unidirectional and <5 ns for bidirectional
Operating and Storage temperature: -65 ºC to +150 ºC
Thermal resistance: 20 ºC/W junction to lead, or 80 ºC/W junction to ambient when mounted
on FR4 PC board (1oz Cu) with recommended footprint (see page 2)
Steady-State Power dissipation: 6 watts at TL = 30 ºC, or 1.56 watts at TA = 25 ºC when
mounted on FR4 PC board with recommended footprint (see page 2)
Forward Surge: 200 Amps peak impulse of 8.3 ms half-sine wave at 25 ºC (unidirectional
only)
Solder temperatures: 260 ºC for 10 s (maximum)
RF01001 Rev B, Sept 2011
High Reliability Product Group
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