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MCM63Z836ZP8.5R

Description
IC,SYNC SRAM,256KX36,CMOS,BGA,119PIN,PLASTIC
Categorystorage    storage   
File Size464KB,36 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MCM63Z836ZP8.5R Overview

IC,SYNC SRAM,256KX36,CMOS,BGA,119PIN,PLASTIC

MCM63Z836ZP8.5R Parametric

Parameter NameAttribute value
MakerNXP
Parts packaging codeBGA
package instructionLFBGA,
Contacts119
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time8.5 ns
Other featuresFLOW-THROUGH OR PIPELINED ARCHTECTURE
JESD-30 codeR-PBGA-B119
length20 mm
memory density9437184 bit
Memory IC TypeZBT SRAM
memory width36
Number of functions1
Number of terminals119
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX36
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.65 mm
Terminal locationBOTTOM
width14 mm

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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