|
TL082MDC |
TL082MWC |
Description |
IC DUAL OP-AMP, 20000 uV OFFSET-MAX, 4 MHz BAND WIDTH, UUC, DIE, Operational Amplifier |
IC DUAL OP-AMP, 20000 uV OFFSET-MAX, 4 MHz BAND WIDTH, UUC, WAFER, Operational Amplifier |
Maker |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
Parts packaging code |
WAFER |
WAFER |
package instruction |
DIE, DIE OR CHIP |
, WAFER |
Reach Compliance Code |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
Amplifier type |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
Architecture |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
Maximum average bias current (IIB) |
0.0004 µA |
0.0004 µA |
Maximum bias current (IIB) at 25C |
0.0004 µA |
0.0004 µA |
Nominal Common Mode Rejection Ratio |
100 dB |
100 dB |
frequency compensation |
YES |
YES |
Maximum input offset current (IIO) |
0.004 µA |
0.004 µA |
Maximum input offset voltage |
20000 µV |
20000 µV |
JESD-30 code |
X-XUUC-N |
X-XUUC-N |
low-bias |
YES |
YES |
low-dissonance |
NO |
NO |
Negative supply voltage upper limit |
-18 V |
-18 V |
Nominal Negative Supply Voltage (Vsup) |
-15 V |
-15 V |
Number of functions |
2 |
2 |
Maximum operating temperature |
70 °C |
70 °C |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
Encapsulate equivalent code |
DIE OR CHIP |
WAFER |
Package shape |
UNSPECIFIED |
UNSPECIFIED |
Package form |
UNCASED CHIP |
UNCASED CHIP |
power supply |
+-15 V |
+-15 V |
Certification status |
Not Qualified |
Not Qualified |
minimum slew rate |
8 V/us |
8 V/us |
Nominal slew rate |
13 V/us |
13 V/us |
Maximum slew rate |
5.6 mA |
5.6 mA |
Supply voltage upper limit |
18 V |
18 V |
Nominal supply voltage (Vsup) |
15 V |
15 V |
surface mount |
YES |
YES |
technology |
BIPOLAR |
BIPOLAR |
Temperature level |
COMMERCIAL |
COMMERCIAL |
Terminal form |
NO LEAD |
NO LEAD |
Terminal location |
UPPER |
UPPER |
Nominal Uniform Gain Bandwidth |
4000 kHz |
4000 kHz |
Minimum voltage gain |
15000 |
15000 |