EEPROM, 256KX8, Serial, CMOS, PBGA8, 2 X 1.50 MM, 0.50 MM PITCH, GREEN, VFBGA-8
Parameter Name | Attribute value |
Maker | Atmel (Microchip) |
Parts packaging code | BGA |
package instruction | VFBGA, |
Contacts | 8 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.1.B.1 |
Other features | 100 YEAR DATA RETENTION |
Maximum clock frequency (fCLK) | 1 MHz |
Data retention time - minimum | 100 |
JESD-30 code | R-PBGA-B8 |
JESD-609 code | e3 |
length | 2 mm |
memory density | 2097152 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | SERIAL |
Certification status | Not Qualified |
Maximum seat height | 0.85 mm |
Serial bus type | I2C |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 1.7 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | MATTE TIN |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
width | 1.5 mm |
Maximum write cycle time (tWC) | 5 ms |
AT24C02CU3-CUM-T | AT24C02C-TSUM-T | AT24C02CY6-MAHM-T | |
---|---|---|---|
Description | EEPROM, 256KX8, Serial, CMOS, PBGA8, 2 X 1.50 MM, 0.50 MM PITCH, GREEN, VFBGA-8 | EEPROM, 256KX8, Serial, CMOS, PDSO5, 2.90 X 1.60 MM, GREEN, PLASTIC, MO-193AB, SOT-23, 5 PIN | EEPROM, 256KX8, Serial, CMOS, PDSO8, 2.00 X 3.00 MM, 0.50 MM PITCH, GREEN, MO-229, UDFN-8 |
Parts packaging code | BGA | TSOT | SON |
package instruction | VFBGA, | TSSOP, | HVSON, |
Contacts | 8 | 5 | 8 |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | 3A991.B.1.B.1 | 3A991.B.1.B.1 | 3A991.B.1.B.1 |
Other features | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION |
Maximum clock frequency (fCLK) | 1 MHz | 1 MHz | 1 MHz |
Data retention time - minimum | 100 | 100 | 100 |
JESD-30 code | R-PBGA-B8 | R-PDSO-G5 | R-PDSO-N8 |
JESD-609 code | e3 | e3 | e4 |
length | 2 mm | 2.9 mm | 3 mm |
memory density | 2097152 bit | 2097152 bit | 2097152 bit |
Memory IC Type | EEPROM | EEPROM | EEPROM |
memory width | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 8 | 5 | 8 |
word count | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C |
organize | 256KX8 | 256KX8 | 256KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | VFBGA | TSSOP | HVSON |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Parallel/Serial | SERIAL | SERIAL | SERIAL |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 0.85 mm | 1.1 mm | 0.6 mm |
Serial bus type | I2C | I2C | I2C |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 1.7 V | 1.7 V | 1.7 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | MATTE TIN | MATTE TIN | NICKEL PALLADIUM GOLD |
Terminal form | BALL | GULL WING | NO LEAD |
Terminal pitch | 0.5 mm | 0.95 mm | 0.5 mm |
Terminal location | BOTTOM | DUAL | DUAL |
width | 1.5 mm | 1.6 mm | 2 mm |
Maximum write cycle time (tWC) | 5 ms | 5 ms | 5 ms |
Maker | Atmel (Microchip) | - | Atmel (Microchip) |