Flash, 512KX32, 54ns, PBGA80, 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-80
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | SPANSION |
Parts packaging code | BGA |
package instruction | LBGA, BGA80,8X10,40 |
Contacts | 80 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 54 ns |
Other features | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK |
startup block | BOTTOM |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PBGA-B80 |
JESD-609 code | e1 |
length | 13 mm |
memory density | 16777216 bit |
Memory IC Type | FLASH |
memory width | 32 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of departments/size | 16,30 |
Number of terminals | 80 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
organize | 512KX32 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Encapsulate equivalent code | BGA80,8X10,40 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.8/3.3,3.3 V |
Programming voltage | 3.3 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 1.4 mm |
Department size | 2K,16K |
Maximum standby current | 0.00006 A |
Maximum slew rate | 0.09 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal surface | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 40 |
switch bit | YES |
type | NOR TYPE |
width | 11 mm |