TC74HC283AP(F) datasheet, PDF - EEWORLD Datasheet

TC74HC283AP(F): DescriptionIC HC/UH SERIES, 4-BIT ADDER/SUBTRACTOR, PDIP16, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-16, Arithmetic Circuit; Categorylogic logic; File Size255KB，9 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/; Environmental Compliance

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TC74HC283AP(F) Overview

IC HC/UH SERIES, 4-BIT ADDER/SUBTRACTOR, PDIP16, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-16, Arithmetic Circuit

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Toshiba Semiconductor
Parts packaging code	DIP
package instruction	DIP,
Contacts	16
Reach Compliance Code	unknown
series	HC/UH
JESD-30 code	R-PDIP-T16
length	19.25 mm
Logic integrated circuit type	ADDER/SUBTRACTOR
Number of digits	4
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
propagation delay (tpd)	265 ns
Maximum seat height	4.45 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

	TC74HC283AP(F)	TC74HC283AF(F)
Description	IC HC/UH SERIES, 4-BIT ADDER/SUBTRACTOR, PDIP16, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-16, Arithmetic Circuit	IC,BINARY ADDER,HC-CMOS,SOP,16PIN,PLASTIC
Is it Rohs certified?	conform to	conform to
package instruction	DIP,	SOP, SOP16,.3
Reach Compliance Code	unknown	unknown
JESD-30 code	R-PDIP-T16	R-PDSO-G16
Logic integrated circuit type	ADDER/SUBTRACTOR	ADDER/SUBTRACTOR
Number of terminals	16	16
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE
surface mount	NO	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL

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