EEPROM, 512X8, Serial, CMOS, PDSO8, SOP-8
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | ABLIC |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Other features | DATA RETENTION 10 YEARS |
| Maximum clock frequency (fCLK) | 0.1 MHz |
| Data retention time - minimum | 10 |
| JESD-30 code | R-PDSO-G8 |
| length | 4.9 mm |
| memory density | 4096 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 512 words |
| character code | 512 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 512X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 1.75 mm |
| Serial bus type | I2C |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 3.9 mm |
| Maximum write cycle time (tWC) | 5 ms |
| S-24C04AFJTB-01 | S-24C01ADPA-01 | S-24C01AFJTB-01 | S-24C01AFJATB-01 | S-24C02AFJATB-01 | S-24C02AFJTB-01 | S-24C04AFJATB-01 | |
|---|---|---|---|---|---|---|---|
| Description | EEPROM, 512X8, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 128X8, Serial, CMOS, PDIP8, DIP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 128X8, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 256X8, Serial, CMOS, PDSO8, SOP-8 | EEPROM, 512X8, Serial, CMOS, PDSO8, SOP-8 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC |
| Parts packaging code | SOIC | DIP | SOIC | SOIC | SOIC | SOIC | SOIC |
| package instruction | SOP, | DIP, | SOP, | SOP, | SOP, | SOP, | SOP, |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | DATA RETENTION 10 YEARS | DATA RETENTION 10 YEARS | DATA RETENTION 10 YEARS | DATA RETENTION 10 YEARS | DATA RETENTION 10 YEARS | DATA RETENTION 10 YEARS | DATA RETENTION 10 YEARS |
| Maximum clock frequency (fCLK) | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
| Data retention time - minimum | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| JESD-30 code | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| length | 4.9 mm | 9.3 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm |
| memory density | 4096 bit | 1024 bit | 1024 bit | 1024 bit | 2048 bit | 2048 bit | 4096 bi |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 512 words | 128 words | 128 words | 128 words | 256 words | 256 words | 512 words |
| character code | 512 | 128 | 128 | 128 | 256 | 256 | 512 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 512X8 | 128X8 | 128X8 | 128X8 | 256X8 | 256X8 | 512X8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | SOP | SOP | SOP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.75 mm | 4.5 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| Serial bus type | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| surface mount | YES | NO | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| Maximum write cycle time (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| Is it lead-free? | - | - | Contains lead | Contains lead | Contains lead | Contains lead | - |
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