|
TC534000AF |
TC534000AP |
Description |
IC 512K X 8 MASK PROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM |
IC 512K X 8 MASK PROM, 150 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM |
Is it lead-free? |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
Toshiba Semiconductor |
Toshiba Semiconductor |
Parts packaging code |
SOIC |
DIP |
package instruction |
0.525 INCH, PLASTIC, SOP-32 |
0.600 INCH, PLASTIC, DIP-32 |
Contacts |
32 |
32 |
Reach Compliance Code |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
Maximum access time |
150 ns |
150 ns |
JESD-30 code |
R-PDSO-G32 |
R-PDIP-T32 |
JESD-609 code |
e0 |
e0 |
length |
20.6 mm |
42 mm |
memory density |
4194304 bit |
4194304 bit |
Memory IC Type |
MASK ROM |
MASK ROM |
memory width |
8 |
8 |
Number of functions |
1 |
1 |
Number of terminals |
32 |
32 |
word count |
524288 words |
524288 words |
character code |
512000 |
512000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
organize |
512KX8 |
512KX8 |
Output characteristics |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
DIP |
Encapsulate equivalent code |
SOP32,.56 |
DIP32,.6 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
IN-LINE |
Parallel/Serial |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
240 |
240 |
power supply |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
2.8 mm |
4.8 mm |
Maximum standby current |
0.00002 A |
0.00002 A |
Maximum slew rate |
0.05 mA |
0.05 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
surface mount |
YES |
NO |
technology |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
GULL WING |
THROUGH-HOLE |
Terminal pitch |
1.27 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
10.7 mm |
15.24 mm |