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TC534000AF

Description
IC 512K X 8 MASK PROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM
Categorystorage    storage   
File Size84KB,4 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TC534000AF Overview

IC 512K X 8 MASK PROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM

TC534000AF Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
Parts packaging codeSOIC
package instruction0.525 INCH, PLASTIC, SOP-32
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time150 ns
JESD-30 codeR-PDSO-G32
JESD-609 codee0
length20.6 mm
memory density4194304 bit
Memory IC TypeMASK ROM
memory width8
Number of functions1
Number of terminals32
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP32,.56
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height2.8 mm
Maximum standby current0.00002 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width10.7 mm

TC534000AF Related Products

TC534000AF TC534000AP
Description IC 512K X 8 MASK PROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM IC 512K X 8 MASK PROM, 150 ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32, Programmable ROM
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Toshiba Semiconductor Toshiba Semiconductor
Parts packaging code SOIC DIP
package instruction 0.525 INCH, PLASTIC, SOP-32 0.600 INCH, PLASTIC, DIP-32
Contacts 32 32
Reach Compliance Code unknown unknown
ECCN code EAR99 EAR99
Maximum access time 150 ns 150 ns
JESD-30 code R-PDSO-G32 R-PDIP-T32
JESD-609 code e0 e0
length 20.6 mm 42 mm
memory density 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
memory width 8 8
Number of functions 1 1
Number of terminals 32 32
word count 524288 words 524288 words
character code 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C
organize 512KX8 512KX8
Output characteristics 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP
Encapsulate equivalent code SOP32,.56 DIP32,.6
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 240 240
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum seat height 2.8 mm 4.8 mm
Maximum standby current 0.00002 A 0.00002 A
Maximum slew rate 0.05 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount YES NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 10.7 mm 15.24 mm

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