S82S09F/883B datasheet, PDF - EEWORLD Datasheet

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S82S09F/883B: DescriptionStandard SRAM, 64X9, 80ns, TTL, CDIP28,; Categorystorage storage; File Size207KB，4 Pages; ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.); Websitehttps://www.nxp.com/

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S82S09F/883B Overview

Standard SRAM, 64X9, 80ns, TTL, CDIP28,

S82S09F/883B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Philips Semiconductors (NXP Semiconductors N.V.)
package instruction	DIP, DIP28,.6
Reach Compliance Code	unknown
Maximum access time	80 ns
JESD-30 code	R-XDIP-T28
JESD-609 code	e0
Memory IC Type	STANDARD SRAM
memory width	9
Number of terminals	28
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64X9
Output characteristics	OPEN-COLLECTOR
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

S82S09F/883B Related Products

	S82S09F/883B	N82S09I	N82S09F	N82S09AA	N82S09AN-B	N82S09N-B	S82S09AR/883C	S82S09AI/883B	S82S09AR/883B	S82S09I/883B
Description	Standard SRAM, 64X9, 80ns, TTL, CDIP28,	Standard SRAM, 64X9, 45ns, TTL, CDIP28	Standard SRAM, 64X9, 45ns, TTL, CDIP28,	Standard SRAM, 64X9, 35ns, TTL, PQCC28	Standard SRAM, 64X9, 35ns, TTL, PDIP28	Standard SRAM, 64X9, 45ns, TTL, PDIP28	Standard SRAM, 64X9, 60ns, TTL, CDFP28	Standard SRAM, 64X9, 60ns, TTL, CDIP28	Standard SRAM, 64X9, 60ns, TTL, CDFP28	Standard SRAM, 64X9, 80ns, TTL, CDIP28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP28,.6	DIP, DIP28,.6	DIP, DIP28,.6	QCCJ, LDCC28,.5SQ	DIP, DIP28,.6	DIP, DIP28,.6	DFP, FL28,.4	DIP, DIP28,.6	DFP, FL28,.4	DIP, DIP28,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	80 ns	45 ns	45 ns	35 ns	35 ns	45 ns	60 ns	60 ns	60 ns	80 ns
JESD-30 code	R-XDIP-T28	R-XDIP-T28	R-XDIP-T28	S-PQCC-J28	R-PDIP-T28	R-PDIP-T28	R-XDFP-F28	R-XDIP-T28	R-XDFP-F28	R-XDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	9	9	9	9	9	9	9	9	9	9
Number of terminals	28	28	28	28	28	28	28	28	28	28
word count	64 words	64 words	64 words	64 words	64 words	64 words	64 words	64 words	64 words	64 words
character code	64	64	64	64	64	64	64	64	64	64
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C	125 °C	125 °C	125 °C
organize	64X9	64X9	64X9	64X9	64X9	64X9	64X9	64X9	64X9	64X9
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	QCCJ	DIP	DIP	DFP	DIP	DFP	DIP
Encapsulate equivalent code	DIP28,.6	DIP28,.6	DIP28,.6	LDCC28,.5SQ	DIP28,.6	DIP28,.6	FL28,.4	DIP28,.6	FL28,.4	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	FLATPACK	IN-LINE	FLATPACK	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	NO	NO	YES	NO	YES	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE	FLAT	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	Philips Semiconductors (NXP Semiconductors N.V.)	-	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified

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