MB8418-20Z datasheet, PDF - EEWORLD Datasheet

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MB8418-20Z: DescriptionStandard SRAM, 2KX8, 200ns, CMOS, CDIP24; Categorystorage storage; File Size153KB，6 Pages; ManufacturerFUJITSU; Websitehttp://edevice.fujitsu.com/fmd/en/index.html

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MB8418-20Z Overview

Standard SRAM, 2KX8, 200ns, CMOS, CDIP24

MB8418-20Z Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	FUJITSU
Parts packaging code	DIP
package instruction	DIP, DIP24,.6
Contacts	24
Reach Compliance Code	unknown
Maximum access time	200 ns
I/O type	COMMON
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	16384 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of terminals	24
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.00001 A
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MB8418-20Z Related Products

	MB8418-20Z	MB8418-20LP	MB8418-20LZ	MB8418-20P
Description	Standard SRAM, 2KX8, 200ns, CMOS, CDIP24	Standard SRAM, 2KX8, 200ns, CMOS, PDIP24	Standard SRAM, 2KX8, 200ns, CMOS, CDIP24	Standard SRAM, 2KX8, 200ns, CMOS, PDIP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	FUJITSU	FUJITSU	FUJITSU	FUJITSU
Parts packaging code	DIP	DIP	DIP	DIP
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Contacts	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	200 ns	200 ns	200 ns	200 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDIP-T24	R-PDIP-T24	R-XDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0
memory density	16384 bit	16384 bit	16384 bit	16384 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8
Number of terminals	24	24	24	24
word count	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	2KX8	2KX8	2KX8	2KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.00001 A	0.000001 A	0.000001 A	0.00001 A
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER	OTHER	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL

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